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公开(公告)号：US10086620B2
公开(公告)日：2018-10-02
申请号：US15842469
申请日：2017-12-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an integrated circuit connected to the single flexible substrate, and an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller. The electrical connector pad array includes first electrical connector pads connected to the integrated circuit and second electrical connector pads for connection to a fluid dispensing die.
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公开(公告)号：US09630417B2
公开(公告)日：2017-04-25
申请号：US15167273
申请日：2016-05-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an electronic memory on the substrate, an authentication code stored on the memory, first electrical connector pads on the substrate connected to the memory, and second electrical connector pads on the substrate, not connected to the memory, to connect to a fluid dispensing die.
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公开(公告)号：US20180104958A1
公开(公告)日：2018-04-19
申请号：US15842469
申请日：2017-12-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an integrated circuit connected to the single flexible substrate, and an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller. The electrical connector pad array includes first electrical connector pads connected to the integrated circuit and second electrical connector pads for connection to a fluid dispensing die.
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公开(公告)号：US09849681B2
公开(公告)日：2017-12-26
申请号：US15039571
申请日：2013-11-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Eugene Cahill , Ivor Cummins , William Jon Rittgers
CPC classification number: B41J2/175 , B41J2/17509 , B41J2/17513 , B41J2/1752 , B41J2/17523 , B41J2/17553 , B41J2002/14419
Abstract: A structure comprises inlets through which respective liquids are to be introduced and multiple unique vent paths each corresponding to one of the inlets.
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公开(公告)号：US20170173949A1
公开(公告)日：2017-06-22
申请号：US15039571
申请日：2013-11-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Eugene Cahill , Ivor Cummins , William Jon Rittgers
IPC: B41J2/14
CPC classification number: B41J2/175 , B41J2/17509 , B41J2/17513 , B41J2/1752 , B41J2/17523 , B41J2/17553 , B41J2002/14419
Abstract: A structure comprises inlets through which respective liquids are to be introduced and multiple unique vent paths each corresponding to one of the inlets.
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Patent Agency Ranking
公开(公告)号：US20160271959A1
公开(公告)日：2016-09-22
申请号：US15167273
申请日：2016-05-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an electronic memory on the substrate, an authentication code stored on the memory, first electrical connector pads on the substrate connected to the memory, and second electrical connector pads on the substrate, not connected to the memory, to connect to a fluid dispensing die.
Abstract translation: 在一个示例中，用于流体盒的柔性电路包括单个柔性衬底，衬底上的电子存储器，存储在存储器上的认证代码，连接到存储器的衬底上的第一电连接器焊盘和连接到存储器的第二电连接器焊盘 未连接到存储器的基板连接到流体分配管芯。
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公开(公告)号：US10214019B2
公开(公告)日：2019-02-26
申请号：US14863902
申请日：2015-09-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
Abstract: Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.
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公开(公告)号：US09475297B2
公开(公告)日：2016-10-25
申请号：US14962177
申请日：2015-12-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Iain Campbell-Brown , Eugene Cahill , William S Osborne , Anoop Haridasan , Ivor Cummins
CPC classification number: B41J2/1752 , B41J2/14 , B41J2/17513 , B41J2/17523 , B41J2/17553 , B41J2/19 , B41J2202/02
Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side; an inlet tower through which liquid may be introduced into the structure; an opening through the substrate near the inlet tower; and an air channel along the substrate connecting the opening in the substrate to the atmosphere.
Abstract translation: 在一个示例中，用于支撑打印头的结构包括：具有第一侧和第二侧的基板; 入口塔，液体可以通过入口塔引入结构中; 通过入口塔附近的基板的开口; 以及沿着基板将基板中的开口连接到大气的空气通道。
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公开(公告)号：US20160036150A1
公开(公告)日：2016-02-04
申请号：US14863902
申请日：2015-09-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.
Abstract translation: 描述了涉及用于流体盒的柔性基板的示例电路和方法，包括连接到柔性基板的集成电路以及布置在柔性基板上的用于连接到集成电路的电连接器焊盘。
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公开(公告)号：US08684505B2
公开(公告)日：2014-04-01
申请号：US13626686
申请日：2012-09-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , William Scott Osborne , Eugene Cahill , Ivor Cummins , Anoop Haridasan
CPC classification number: B41J2/19 , B41J2/17513 , B41J2/1752
Abstract: In one example, a structure for supporting a printhead includes: a substrate having a first side and a second side; multiple inlets each protruding from the first side of the substrate through which liquids may be introduced into the structure from the outlets of liquid containers that can be attached to the structure; multiple openings through the substrate from the first side to the second side, each opening positioned near one of the inlets at a location exposed to the outlet of a corresponding one of the containers when the container is attached to the structure; and an air channel on the second side of the substrate connecting each of one or more of the openings to another opening.
Abstract translation: 在一个示例中，用于支撑打印头的结构包括：具有第一侧和第二侧的基板; 多个入口各自从基板的第一侧突出，液体可以通过该入口从可附接到结构的液体容器的出口引入到结构中; 多个开口穿过基板从第一侧到第二侧，当容器附接到结构时，每个开口位于暴露于对应的一个容器的出口的位置处的一个入口附近; 以及在所述基板的第二侧上的空气通道，其将一个或多个所述开口中的每一个连接到另一个开口。
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