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公开(公告)号：US09815290B2
公开(公告)日：2017-11-14
申请号：US15110038
申请日：2014-01-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Aidan O'Reilly , Mark Walsh , Garry Rooney , Tommy O'Connor , John Oliver , Brendan Hall , Willie Sheehan , Stephen Byrne , Michael Dineen
CPC classification number: B41J2/17553 , B41J2/17513 , B41J2/21
Abstract: A replaceable tri-color ink cartridge, comprising three chambers for different colors ink; a headland having headland slots each fluidically connected to a respective chamber; and a printhead die attached to the headland, the die including (i) nozzle arrays having a length of at least 14.3 millimeters, and (ii) feed slots that fluidically connect the headland slots to the respective nozzle arrays, wherein each headland slot is longer than the corresponding feed slot.
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公开(公告)号：US10214019B2
公开(公告)日：2019-02-26
申请号：US14863902
申请日：2015-09-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
Abstract: Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.
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公开(公告)号：US20160036150A1
公开(公告)日：2016-02-04
申请号：US14863902
申请日：2015-09-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.
Abstract translation: 描述了涉及用于流体盒的柔性基板的示例电路和方法，包括连接到柔性基板的集成电路以及布置在柔性基板上的用于连接到集成电路的电连接器焊盘。
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Patent Agency Ranking
公开(公告)号：US20180104958A1
公开(公告)日：2018-04-19
申请号：US15842469
申请日：2017-12-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an integrated circuit connected to the single flexible substrate, and an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller. The electrical connector pad array includes first electrical connector pads connected to the integrated circuit and second electrical connector pads for connection to a fluid dispensing die.
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公开(公告)号：US20160271959A1
公开(公告)日：2016-09-22
申请号：US15167273
申请日：2016-05-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an electronic memory on the substrate, an authentication code stored on the memory, first electrical connector pads on the substrate connected to the memory, and second electrical connector pads on the substrate, not connected to the memory, to connect to a fluid dispensing die.
Abstract translation: 在一个示例中，用于流体盒的柔性电路包括单个柔性衬底，衬底上的电子存储器，存储在存储器上的认证代码，连接到存储器的衬底上的第一电连接器焊盘和连接到存储器的第二电连接器焊盘 未连接到存储器的基板连接到流体分配管芯。
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公开(公告)号：US10086620B2
公开(公告)日：2018-10-02
申请号：US15842469
申请日：2017-12-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an integrated circuit connected to the single flexible substrate, and an electrical connector pad array arranged in a constant pattern on the single flexible substrate for connection to a host controller. The electrical connector pad array includes first electrical connector pads connected to the integrated circuit and second electrical connector pads for connection to a fluid dispensing die.
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公开(公告)号：US09987852B2
公开(公告)日：2018-06-05
申请号：US15110725
申请日：2014-01-30
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Aidan O'Reilly , Mark Walsh , Garry Rooney , Tommy O'Connor , John Oliver , Brendan Hall , Willie Sheehan , Stephen Byrne , Michael Dineen
CPC classification number: B41J2/17553 , B41J2/17513 , B41J2/21
Abstract: In one example a replaceable tri-color ink cartridge housing includes three chambers for different colors ink. In a further example, a headland may have three parallel ink slots having a length of at least 14.4 millimeters.
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公开(公告)号：US09630417B2
公开(公告)日：2017-04-25
申请号：US15167273
申请日：2016-05-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
IPC: B41J2/175
CPC classification number: B41J2/17543 , B41J2/17513 , B41J2/1753 , B41J2/17546 , B41J2/17553 , H01L2224/97
Abstract: In one example, a flexible circuit for a fluid cartridge includes a single flexible substrate, an electronic memory on the substrate, an authentication code stored on the memory, first electrical connector pads on the substrate connected to the memory, and second electrical connector pads on the substrate, not connected to the memory, to connect to a fluid dispensing die.
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