公开(公告)号：US20180001567A1

公开(公告)日：2018-01-04

申请号：US15542052

申请日：2015-01-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Fernando JUAN ,  Pau MARTIN VIDAL ,  Esteve COMAS ,  Jordi GIMENEZ MANENT ,  Pol MORRAL ,  Pablo DOMINGUEZ PASTOR

IPC: B29C64/393 ,  B29C64/255 ,  B23K26/342 ,  B33Y50/02 ,  B29C64/295 ,  B33Y30/00 ,  B29C64/153

CPC classification number: B29C64/393 ,  B22F3/1055 ,  B22F2003/1056 ,  B22F2003/1057 ,  B23K26/342 ,  B29C64/153 ,  B29C64/255 ,  B29C64/295 ,  B29C64/386 ,  B33Y30/00 ,  B33Y50/02 ,  Y02P10/295

Abstract: A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.

公开(公告)号：US20190039301A1

公开(公告)日：2019-02-07

申请号：US16075444

申请日：2016-10-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Haseeb YUSEF ,  William WINTERS ,  Jordi GIMENEZ MANENT ,  Xavier GASSO PUCHAL ,  Eduardo RUIZ MARTINEZ ,  Drew BERWAGER ,  Brent EWALD ,  Micah ABERTH

IPC: B29C64/218 ,  B33Y30/00

Abstract: According to an example, a recoater for a three-dimensional (3D) printer may include a cylindrical element having a surface to spread build material particles. The build material particles may have a specified average dimension and the surface may include a plurality of depressions that have dimensions that are smaller than the specified average dimension of the build material particles.