公开(公告)号：US20210195067A1

公开(公告)日：2021-06-24

申请号：US16079767

申请日：2017-04-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua Peter YASBEK ,  Todd GOYEN ,  Robert D. DAVIS ,  Asa WEISS ,  Arthur H. BARNES

IPC: H04N5/225 ,  H04N5/232 ,  H04N5/33

Abstract: An example system includes an imaging device and an enclosure substantially separating the imaging device from an outside environment. The enclosure includes an air intake to force air into the enclosure and an aperture to allow air to escape the enclosure. The air intake and the aperture maintain an air pressure level in the enclosure greater than an air pressure of the outside environment.

公开(公告)号：US20210199508A1

公开(公告)日：2021-07-01

申请号：US16074896

申请日：2017-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua Peter YASBEK ,  Todd GOYEN ,  David SORIANO FOSAS ,  Asa WEISS ,  Arthur H. BARNES

IPC: G01J5/10 ,  G01J5/06

Abstract: In an example, an apparatus is described that includes a non-resistive heat source, a thermally conductive face, and a temperature detector. The thermally conductive face has a controlled long-wave infrared emissivity and is in thermal contact with the non-resistive heat source. The temperature detector is positioned to detect a temperature of the thermally conductive face.

公开(公告)号：US20210208003A1

公开(公告)日：2021-07-08

申请号：US16075701

申请日：2017-07-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua Peter YASBEK ,  Todd GOYEN ,  David SORIANO ,  Asa WEISS ,  Arthur H. BARNES

IPC: G01J5/04 ,  G01J5/08 ,  G01J5/02 ,  B29C64/30

Abstract: Some examples include a thermal imaging assembly, comprising a thermal sensor having a field of view and optics, an emitting source to validate the optics in the field of view, an emitter storage to selectively house the emitting source outside of the field of view, and a carrier to move the emitting source between the emitter storage and the field of view.

公开(公告)号：US20210203861A1

公开(公告)日：2021-07-01

申请号：US16075222

申请日：2017-07-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua Peter YASBEK ,  Todd GOYEN ,  David SORIANO ,  Asa WEISS ,  Arthur H. BARNES

IPC: H04N5/33 ,  G01J5/22

Abstract: Some examples include a thermal imaging assembly, comprising a thermal imaging device including a thermal sensor, a transistor to generate heat, a thermal jacket forming a cavity to house the thermal imaging device, the thermal jacket forming a space around the thermal imaging device, the thermal jacket thermally coupled to the transistor to transmit heat generated by the transistor to the cavity, and an insulative shell disposed around the thermal jacket to maintain a temperature of the thermal imaging device within the insulative shell.