公开(公告)号：US20210206056A1

公开(公告)日：2021-07-08

申请号：US16075483

申请日：2017-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Arthur H. BARNES

IPC: B29C64/165 ,  B29C64/236 ,  B29C64/393 ,  B29C64/277 ,  B29C64/314 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/10 ,  B33Y50/02

Abstract: Some examples include a fusing apparatus for an additive manufacturing machine. The fusing apparatus includes an enclosure movable in an x-direction across the build zone, the build zone is to contain a build material and a fusing agent. A thermic source is housed in the enclosure, the thermic source is to direct thermic energy toward the build zone and includes a warming source to emit a first emission spectrum and a fusing source to emit a second emission spectrum. A control is to continuously modulate levels of the thermal energy produced by the thermic source during a build cycle.

公开(公告)号：US20210203176A1

公开(公告)日：2021-07-01

申请号：US16076300

申请日：2017-04-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Arthur H. BARNES ,  David E. SMITH ,  William WINTERS

IPC: H02J7/00 ,  G01R19/165 ,  H02J7/04 ,  B29C64/20 ,  B33Y30/00

Abstract: A power control system enables an electrical apparatus to intermittently operate at power levels which exceed an available facility power. The power control system draws a sufficiently high current from a power source (e.g., mains supply) to supply power to components of the apparatus that generate a continuous below-threshold load, while at the same time, supplying a charge current for a battery module. The power control system can operate to use the battery module to supply power to components of the apparatus that draw excess power when the electrical apparatus operates at an above-threshold power level.

公开(公告)号：US20200147886A1

公开(公告)日：2020-05-14

申请号：US16620362

申请日：2017-07-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Nicholas WANG ,  Michael CROCKETT ,  William WINTERS ,  Arthur H. BARNES ,  Wesley R. SCHALK ,  Justin M. ROMAN

IPC: B29C64/35 ,  B29C64/218 ,  B29C64/357 ,  B29C64/393 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y40/00 ,  B29C64/321

Abstract: The technology described herein includes a spreader that creates scattered incidental particles in a build chamber when spreading build material is applied in the build platform. One or more vacuum sources create negative pressure zones in one or more receptacles to collect the incidental particles in the build chamber during printing process and thus minimize the scattering of the incidental particles.

公开(公告)号：US20210208003A1

公开(公告)日：2021-07-08

申请号：US16075701

申请日：2017-07-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua Peter YASBEK ,  Todd GOYEN ,  David SORIANO ,  Asa WEISS ,  Arthur H. BARNES

IPC: G01J5/04 ,  G01J5/08 ,  G01J5/02 ,  B29C64/30

Abstract: Some examples include a thermal imaging assembly, comprising a thermal sensor having a field of view and optics, an emitting source to validate the optics in the field of view, an emitter storage to selectively house the emitting source outside of the field of view, and a carrier to move the emitting source between the emitter storage and the field of view.

公开(公告)号：US20210203861A1

公开(公告)日：2021-07-01

申请号：US16075222

申请日：2017-07-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua Peter YASBEK ,  Todd GOYEN ,  David SORIANO ,  Asa WEISS ,  Arthur H. BARNES

IPC: H04N5/33 ,  G01J5/22

Abstract: Some examples include a thermal imaging assembly, comprising a thermal imaging device including a thermal sensor, a transistor to generate heat, a thermal jacket forming a cavity to house the thermal imaging device, the thermal jacket forming a space around the thermal imaging device, the thermal jacket thermally coupled to the transistor to transmit heat generated by the transistor to the cavity, and an insulative shell disposed around the thermal jacket to maintain a temperature of the thermal imaging device within the insulative shell.

公开(公告)号：US20210178667A1

公开(公告)日：2021-06-17

申请号：US16076543

申请日：2017-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Arthur H. BARNES ,  Wesley R. SCHALK ,  Matthew A. SHEPHERD

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/295

Abstract: In an example implementation, a method of forming a three-dimensional (3D) part includes spreading a layer of build material over a print bed, and heating the layer of build material during each of multiple consecutive carriage passes over the print bed to maintain printed portions of the build material above a melting temperature for the duration of the consecutive carriage passes.

公开(公告)号：US20210008798A1

公开(公告)日：2021-01-14

申请号：US16505503

申请日：2019-07-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Arthur H. BARNES ,  William Winters ,  Daniel Fredrickson

IPC: B29C64/264 ,  B29C64/153 ,  B33Y30/00

Abstract: According to examples, an apparatus may include a back panel to absorb energy and an energy emitter to supply energy onto a build material layer. The energy emitter may include an energy emitting element and an outer tube. In addition, a reflective element may be provided on a portion of the outer tube facing the back panel to direct energy away from the back panel. The apparatus may also include a transparent panel, in which energy from the energy emitter may be emitted through the transparent panel and onto the build material layer.

公开(公告)号：US20210206080A1

公开(公告)日：2021-07-08

申请号：US16074458

申请日：2017-02-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Arthur H. BARNES ,  William F. WINTERS

IPC: B29C64/295 ,  B29C64/153 ,  B29C64/165 ,  B29C64/291 ,  B29C64/25 ,  B29C64/364 ,  B29C64/393

Abstract: An additive manufacturing build material fusing apparatus may include a housing, a window, a thermal reflector between the housing and the window, a first interior behind the reflector between the housing and the reflector, a second interior in front of the reflector between the reflector and the window, a heating device in the second interior, an airflow passage and a fan. The heating device may include at least one heating unit. The airflow passage may have an inlet connected to the first interior, a connector passage connecting the first interior to the second interior and an outlet connected to the second interior. The fan moves air along the airflow passage.

公开(公告)号：US20210206073A1

公开(公告)日：2021-07-08

申请号：US16074459

申请日：2017-02-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Arthur H. BARNES ,  William F. WINTERS

IPC: B29C64/25 ,  B29C64/165 ,  B29C64/291 ,  B29C64/295 ,  B29C64/364

Abstract: An additive manufacturing fusing module for use with an additive manufacturing base unit may include a housing, a reflector within the housing, a fusing unit within the housing, an electrical power connector connected to the heating device and having a terminal for releasable connection to a power source and a retainer coupled to the housing to releasably secure the housing to the additive manufacturing base unit.

公开(公告)号：US20210195067A1

公开(公告)日：2021-06-24

申请号：US16079767

申请日：2017-04-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua Peter YASBEK ,  Todd GOYEN ,  Robert D. DAVIS ,  Asa WEISS ,  Arthur H. BARNES

IPC: H04N5/225 ,  H04N5/232 ,  H04N5/33

Abstract: An example system includes an imaging device and an enclosure substantially separating the imaging device from an outside environment. The enclosure includes an air intake to force air into the enclosure and an aperture to allow air to escape the enclosure. The air intake and the aperture maintain an air pressure level in the enclosure greater than an air pressure of the outside environment.