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公开(公告)号：US20210195067A1
公开(公告)日：2021-06-24
申请号：US16079767
申请日：2017-04-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Joshua Peter YASBEK , Todd GOYEN , Robert D. DAVIS , Asa WEISS , Arthur H. BARNES
Abstract: An example system includes an imaging device and an enclosure substantially separating the imaging device from an outside environment. The enclosure includes an air intake to force air into the enclosure and an aperture to allow air to escape the enclosure. The air intake and the aperture maintain an air pressure level in the enclosure greater than an air pressure of the outside environment.
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Patent Agency Ranking
公开(公告)号：US20190016155A1
公开(公告)日：2019-01-17
申请号：US15650848
申请日：2017-07-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Asa WEISS
Abstract: In an example, a transmission may include a driven gear attached to a module housing of the imaging module. Further, the transmission may include a retention nose fixed or attached to the module housing. The retention nose may engage with a retention shelf of a drive housing and may retain the module housing to the drive housing such that the driven gear is operably engaged with a drive gear attached to the drive housing.
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公开(公告)号：US20210208003A1
公开(公告)日：2021-07-08
申请号：US16075701
申请日：2017-07-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Joshua Peter YASBEK , Todd GOYEN , David SORIANO , Asa WEISS , Arthur H. BARNES
Abstract: Some examples include a thermal imaging assembly, comprising a thermal sensor having a field of view and optics, an emitting source to validate the optics in the field of view, an emitter storage to selectively house the emitting source outside of the field of view, and a carrier to move the emitting source between the emitter storage and the field of view.
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公开(公告)号：US20210203861A1
公开(公告)日：2021-07-01
申请号：US16075222
申请日：2017-07-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Joshua Peter YASBEK , Todd GOYEN , David SORIANO , Asa WEISS , Arthur H. BARNES
Abstract: Some examples include a thermal imaging assembly, comprising a thermal imaging device including a thermal sensor, a transistor to generate heat, a thermal jacket forming a cavity to house the thermal imaging device, the thermal jacket forming a space around the thermal imaging device, the thermal jacket thermally coupled to the transistor to transmit heat generated by the transistor to the cavity, and an insulative shell disposed around the thermal jacket to maintain a temperature of the thermal imaging device within the insulative shell.
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公开(公告)号：US20210199508A1
公开(公告)日：2021-07-01
申请号：US16074896
申请日：2017-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Joshua Peter YASBEK , Todd GOYEN , David SORIANO FOSAS , Asa WEISS , Arthur H. BARNES
Abstract: In an example, an apparatus is described that includes a non-resistive heat source, a thermally conductive face, and a temperature detector. The thermally conductive face has a controlled long-wave infrared emissivity and is in thermal contact with the non-resistive heat source. The temperature detector is positioned to detect a temperature of the thermally conductive face.
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公开(公告)号：US20190024774A1
公开(公告)日：2019-01-24
申请号：US15656221
申请日：2017-07-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Asa WEISS , Kynan Lon CHURCH , Andrzej ROMANSKI , Jeffery S. Mathena
CPC classification number: F16H57/0025 , F16H1/06 , F16H7/02 , F16H37/02 , F16H37/021 , F16H55/06 , F16H55/17 , F16H55/48 , H02K7/1004
Abstract: An example shaft assembly includes a metal shaft and a plastic ring element interference-fitted to the metal shaft. The plastic ring element includes a footing proximate to an outer diameter of the metal shaft. The shaft assembly also includes a metal compression ring interference-fitted to the footing of the plastic ring element to apply a radial locking force between the footing and the metal shaft.
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