公开(公告)号：US11164708B2

公开(公告)日：2021-11-02

申请号：US16982212

申请日：2018-06-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Yu Chen So ,  Weiming Tseng ,  Chi-Chih Huang ,  Lien-Chia Chiu

IPC: H01H13/83

Abstract: Example of backlit switches are described. In an example, a backlit switch includes a printed circuit board (PCB) and a dome-type button coupled to the PCB. The dome-type button has a light transmitting portion. A light source is mounted on a first side of the PCB, and a tact switch is mounted on a second side of the PCB that is opposite to the first side. Further, a projection is provided to trigger the tact switch, in response to pressing of the dome-type button.

公开(公告)号：US10768672B2

公开(公告)日：2020-09-08

申请号：US16074455

申请日：2016-10-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yu-Chen So ,  Chienchih Chiu ,  Chih-Hsiung Liao ,  Lien-Chia Chiu

IPC: G06F1/16

Abstract: In example implementations, a hinge is provided. The hinge comprises a first hinge plate having at least one opening, where the first hinge plate is coupled to a system cover via at least one fastener fitted through the at least one opening. The hinge comprises a second hinge plate movably coupled to the first hinge plate, where the second hinge plate comprises a tab member that is coupled to a display cover via an insert molding process. The hinge comprises a hinge cap to enclose a portion of the first hinge plate and the second hinge plate that are movable coupled.

公开(公告)号：US20210167485A1

公开(公告)日：2021-06-03

申请号：US17047171

申请日：2018-07-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Yu Chen So ,  Ju-Hung Chen ,  Lien-Chia Chiu ,  Hao Ming Chen

IPC: H01Q1/22 ,  G06F1/16 ,  H04B1/034 ,  H01Q1/42

Abstract: In one example, an electronic device may include a housing having an opening and an antenna assembly disposed in the housing. The antenna assembly may include an antenna mounted to the housing, an antenna module disposed corresponding to the opening, and a cable to connect the antenna to the antenna module via routing the cable through the opening.

公开(公告)号：US11799189B2

公开(公告)日：2023-10-24

申请号：US17047171

申请日：2018-07-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Yu Chen So ,  Ju-Hung Chen ,  Lien-Chia Chiu ,  Hao Ming Chen

IPC: H01Q1/22 ,  G06F1/16 ,  H01Q1/42 ,  H04B1/034

CPC classification number: H01Q1/2266 ,  G06F1/1698 ,  H01Q1/42 ,  H04B1/034

Abstract: In one example, an electronic device may include a housing having an opening and an antenna assembly disposed in the housing. The antenna assembly may include an antenna mounted to the housing, an antenna module disposed corresponding to the opening, and a cable to connect the antenna to the antenna module via routing the cable through the opening.

公开(公告)号：US20230055278A1

公开(公告)日：2023-02-23

申请号：US17799943

申请日：2020-03-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hou-Chu Su ,  Wei-Ming Tseng ,  Lien-Chia Chiu ,  Chien-Feng Chu

IPC: G06F1/32 ,  H02J1/08

Abstract: An example computing device includes a power switch, a power management device to control a power state change of the computing device based on a command from a power control device, and a controller. The controller is to, in response to receiving a power control request message from an external device, change the power control device from the power switch to the external device.

公开(公告)号：US20220007531A1

公开(公告)日：2022-01-06

申请号：US17298648

申请日：2019-07-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lien-Chia Chiu ,  Ya-Ting Yeh ,  Kuan-Ting Wu

IPC: H05K5/03 ,  B32B15/08 ,  B32B3/02 ,  C25D11/02 ,  C25D11/30 ,  C23C14/16 ,  C23C14/20 ,  C23C14/24 ,  C23C28/00 ,  B05D3/12 ,  B05D1/02 ,  B05D5/06 ,  B05D7/00

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate joined with an insert molding plastic part, and a protective treatment layer on the light metal substrate and the insert molding plastic part. A transparent primer coating on the protective treatment layer, and a paint coating on the transparent primer coating. A milled edge along the insert molding plastic part, wherein the milled edge cuts through the paint coating to expose the transparent primer coating.

公开(公告)号：US20210125802A1

公开(公告)日：2021-04-29

申请号：US16982212

申请日：2018-06-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Yu Chen So ,  Weiming Tseng ,  Chi-Chih Huang ,  Lien-Chia Chiu

IPC: H01H13/83

Abstract: Example of backlit switches are described. In an example, a backlit switch includes a printed circuit board (PCB) and a dome-type button coupled to the PCB. The dome-type button has a light transmitting portion. A light source is mounted on a first side of the PCB, and a tact switch is mounted on a second side of the PCB that is opposite to the first side. Further, a projection is provided to trigger the tact switch, in response to pressing of the dome-type button.