公开(公告)号：US20150208507A1

公开(公告)日：2015-07-23

申请号：US14417821

申请日：2012-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Robert G Walmsley ,  Zhqing Zhang ,  Jenninfer Wu ,  Sheldon A Bernard ,  Silam J Choy

IPC: H05K1/18 ,  H05K13/04

CPC classification number: H05K1/18 ,  B81B7/0048 ,  B81B2201/0235 ,  G01P15/0802 ,  H01L24/32 ,  H01L2224/32014 ,  H05K13/0469 ,  H05K2203/06 ,  Y10T156/10

Abstract: A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.

Abstract translation: 一种包括半导体，衬底和中介层的器件。 插入器附接在半导体和衬底之间以吸收半导体和衬底之间的应力。