公开(公告)号：US20180304307A1

公开(公告)日：2018-10-25

申请号：US15565481

申请日：2015-05-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ya-Ting YEH ,  KUAN-TING WU ,  YICHIEH CHANG

IPC: B05D7/00 ,  B05D3/00 ,  B05D5/08 ,  B05D7/14

CPC classification number: B05D7/54 ,  B05D3/002 ,  B05D5/083 ,  B05D7/14 ,  C08G2150/90 ,  C09D175/04

Abstract: Provided in one examole hod of manufacturing. The method includes disposing over at least a portion of a substrate a first layer, the substrate comprising a metal material and the first layer comprising a water-borne primer. The method includes disposing over at least a portion of the first layer a second layer, the second layer comprising a water-borne basecoat material. The method includes disposing over at least a portion of the second layer a third layer, the third layer comprising a water-bome topcoat material.

公开(公告)号：US20240158943A1

公开(公告)日：2024-05-16

申请号：US18282661

申请日：2021-03-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Qingyong GUO ,  Ya-Ting YEH ,  Chi Hao CHANG ,  Kuan-Ting WU

IPC: C25D11/12 ,  C25D11/16 ,  C25D11/24

CPC classification number: C25D11/12 ,  C25D11/16 ,  C25D11/243 ,  C25D11/246

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a substrate can include a metal alloy. An acid anodizing layer can be formed on the substrate. A dye application can be applied on the acid anodizing layer. A first nickel-free sealing layer can be formed on the dye application. An alkaline anodizing layer can be formed on the first sealing layer. A second nickel-free sealing layer can be formed on the alkaline anodizing layer.