公开(公告)号：US20180264694A1

公开(公告)日：2018-09-20

申请号：US15760943

申请日：2015-11-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： WEI-FENG YEN ,  QIU FENG YU ,  CHIENCHIH CHIU ,  BIN CHEN

IPC: B29C45/14 ,  B29C45/26 ,  B29C45/03 ,  B22D17/00

CPC classification number: B29C45/14065 ,  B22D17/002 ,  B29C45/03 ,  B29C45/14 ,  B29C45/26 ,  B29C45/33 ,  B29K2705/00 ,  B29K2707/04

Abstract: Examples of techniques for molding molded components are described herein. In an example, a molding apparatus for molding a molded component includes a first mold-half comprising a mold-facing surface, and a slider member mounted on the first mold-half and movable substantially along the mold-facing surface. The first mold-half and the slider member can form a part of a mold cavity therebetween. Further, the molding apparatus includes a second mold-half to cooperate with the first mold-half to complete the mold cavity with the first mold-half and the slider member. The slider member is movable to modify a draft angle provided in the mold cavity.