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1.
公开(公告)号:US20230361691A1
公开(公告)日:2023-11-09
申请号:US18026526
申请日:2021-08-03
Applicant: Hitachi, Ltd.
Inventor: Ryou MOTEKI , Hisashi MOROOKA , Shintarou TAKEDA , Makoto ABE , Hiroshi KAMIZUMA , Kinya NAKATSU
CPC classification number: H02M7/48 , H05K7/2089
Abstract: Please substitute the new Abstract submitted herewith for the original Abstract: This power conversion unit includes a cooling path positioned between an input-side power converter and an output-side power converter arranged separately on two sides that face each other. The input-side and output-side power converters include: a mold resin filled into a space on the inside of housings; a switching element covered by the mold resin, an upper electrode plate connected to the switching element, and a heat dissipation plate having insulating properties connected to the upper electrode plate; and a lower electrode provided near the cooling path. The mold resin is an organopolysiloxane having a three-dimensionally crosslinked structure after curing, in which the elastic modulus at room temperature is 0.1 MPa or greater, and the value when the hardness after curing is 10 or greater as measured using a durometer type E.
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2.
公开(公告)号:US20160163420A1
公开(公告)日:2016-06-09
申请号:US14905189
申请日:2013-07-22
Applicant: HITACHI, LTD.
Inventor: Koutarou ARAYA , Satoru AMOU , Shintarou TAKEDA , Toshiyuki KOBAYASHI , Tadashi ARAI
CPC classification number: H01B7/292 , H01B3/308 , H01B3/427 , H01B7/0216 , H01B13/14
Abstract: An insulated wire producible at low cost and excellent in heat resistance and voltage resistance and a dynamo-electric machine using the insulated wire are provided. The insulated wire includes a conductor and a resin laminated body covering the conductor and formed by a plurality of resin layers being stacked, wherein the resin layer of an outermost layer in the resin laminated body is formed from a resin having maximum heat resistance among resins forming the plurality of resin layers.
Abstract translation: 提供了一种低成本且耐热和耐电压优异的绝缘线以及使用该绝缘线的发电机。 绝缘线包括导体和树脂层叠体,覆盖导体并且由堆叠的多个树脂层形成,其中树脂层叠体中最外层的树脂层由形成树脂的树脂中具有最大耐热性的树脂形成 多个树脂层。
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