公开(公告)号：US20160163420A1

公开(公告)日：2016-06-09

申请号：US14905189

申请日：2013-07-22

Applicant: HITACHI, LTD.

Inventor： Koutarou ARAYA ,  Satoru AMOU ,  Shintarou TAKEDA ,  Toshiyuki KOBAYASHI ,  Tadashi ARAI

IPC: H01B7/29 ,  H01B3/30 ,  H01B7/02

CPC classification number: H01B7/292 ,  H01B3/308 ,  H01B3/427 ,  H01B7/0216 ,  H01B13/14

Abstract: An insulated wire producible at low cost and excellent in heat resistance and voltage resistance and a dynamo-electric machine using the insulated wire are provided. The insulated wire includes a conductor and a resin laminated body covering the conductor and formed by a plurality of resin layers being stacked, wherein the resin layer of an outermost layer in the resin laminated body is formed from a resin having maximum heat resistance among resins forming the plurality of resin layers.

Abstract translation: 提供了一种低成本且耐热和耐电压优异的绝缘线以及使用该绝缘线的发电机。 绝缘线包括导体和树脂层叠体，覆盖导体并且由堆叠的多个树脂层形成，其中树脂层叠体中最外层的树脂层由形成树脂的树脂中具有最大耐热性的树脂形成 多个树脂层。

公开(公告)号：US20130209802A1

公开(公告)日：2013-08-15

申请号：US13764849

申请日：2013-02-12

Applicant: Hitachi, Ltd.

Inventor： Takahito MURAKI ,  Satoru AMOU ,  Hiroyuki KAGAWA

IPC: H01B3/30

CPC classification number: H01B3/30 ,  H01B3/427 ,  Y10T428/2924 ,  Y10T428/2967

Abstract: An object of the present invention is to provide a resin composition showing high heat resistance even in low-temperature curing and an electrical device using the resin composition. The object is solved by a thermosetting resin composition comprising (A) a compound of an oligomer having two or more of radical-polymerizable substituent X of which binding energy of repeated structure is higher than binding energy of carbon-carbon formed by the substituent X; (B) a compound having a polymerizable substituent highly reactive with the substituent X; and (C) a polymerization initiator.

Abstract translation: 本发明的目的是提供即使在低温固化中显示出高耐热性的树脂组合物和使用该树脂组合物的电气装置。 该目的通过热固性树脂组合物来解决，所述热固性树脂组合物包含（A）具有两个或更多个可自由基聚合的取代基X的低聚物的化合物，其重复结构的结合能高于由取代基X形成的碳 - 碳的结合能; （B）具有与取代基X高反应性的聚合性取代基的化合物; 和（C）聚合引发剂。

公开(公告)号：US20150337106A1

公开(公告)日：2015-11-26

申请号：US14655522

申请日：2012-12-26

Applicant: HITACHI, LTD.

Inventor： Yuri KAJIHARA ,  Satoru AMOU ,  Takashi NAITO ,  Yuichi SAWAI ,  Motomune KODAMA

IPC: C08K3/22

CPC classification number: C08K3/22 ,  C03C3/122 ,  C03C3/21 ,  C03C8/14 ,  C08K3/40 ,  C08K2003/2286

Abstract: The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag2O, V2O5, and TeO2, and in which the total content of Ag2O, V2O5, and TeO2 is 75 mass % or more; and a resin composition having a 5% thermal weight reduction temperature equal to or greater than a softening point temperature of the low-melting-point glass composition.

Abstract translation: 本发明的目的是提供一种能够提高绝缘树脂的耐热性和导热性的低熔点玻璃树脂复合材料。 低熔点玻璃树脂复合材料包括：含有Ag2O，V2O5和TeO2的无铅低熔点玻璃组合物，其中Ag2O，V2O5和TeO2的总含量为75质量％，或 更多; 以及具有等于或高于低熔点玻璃组合物的软化点温度的5％热重量还原温度的树脂组合物。

公开(公告)号：US20130131248A1

公开(公告)日：2013-05-23

申请号：US13671614

申请日：2012-11-08

Applicant: Hitachi, Ltd.

Inventor： Tomokazu TANASE ,  Hiroyuki KAGAWA ,  Satoru AMOU

IPC: C09D167/00 ,  C08K3/34 ,  C08K5/17

CPC classification number: C09D167/00 ,  B82Y30/00 ,  C08G73/0644 ,  C08G73/0655 ,  C08G73/0661 ,  C08K3/346 ,  C08K5/0091 ,  C08K5/17 ,  C08K9/04 ,  C09D7/62 ,  C09D7/70 ,  C09D179/04 ,  H01B3/303 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  C08L79/04 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an organic-inorganic composite material having excellent thermal stability, electrical insulation and adhesiveness. The organic-inorganic composite material includes a resin composed of a triazine ring and obtained by thermally curing a varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a curing catalyst for a cyanate ester compound and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound. The invention also provides a varnish which gives the organic-inorganic composite material, and an electrical device and a semiconductor device, each of which includes the organic-inorganic composite material.

Abstract translation: 本发明提供了具有优异的热稳定性，电绝缘性和粘合性的有机 - 无机复合材料。 有机无机复合材料包括由三嗪环组成的树脂，其通过热固化含有层间粘土矿物（经过层间改性的粘土）与氰酸酯化合物的固化催化剂和氰酸酯化合物的混合物的清漆 其中，所述粘土的量为氰酸酯化合物的0.1〜12重量％。 本发明还提供了一种赋予有机 - 无机复合材料的清漆，以及包括有机 - 无机复合材料的电子器件和半导体器件。

公开(公告)号：US20170145209A1

公开(公告)日：2017-05-25

申请号：US15316224

申请日：2015-05-18

Applicant: HITACHI, LTD.

Inventor： Yuri KAJIHARA ,  Satoru AMOU ,  Takahito MURAKI

IPC: C08L63/00 ,  H01B3/44 ,  H01B3/42 ,  C08F222/08 ,  H01B3/40

CPC classification number: C08L63/00 ,  C08F2/44 ,  C08F4/52 ,  C08F12/22 ,  C08F212/14 ,  C08F222/08 ,  C08F2800/10 ,  C08L35/06 ,  C08L2201/08 ,  H01B3/40 ,  H01B3/42 ,  H01B3/425 ,  H01B3/442 ,  C08F222/40 ,  C08F2220/286

Abstract: It is an object of the present invention to provide an excellent thermosetting resin that achieves both higher heat resistance and higher toughness and mechanical strength for improving cracking resistance and lower viscosity which are conventionally in a trade-off relationship. It is also an object of the present invention to provide an electronic•electrical device using a cured product of the thermosetting resin as an insulating material or a structural material. The present invention includes a plurality of means for achieving the above objects, and one of the means is a thermosetting resin composition comprising: a three-dimensional copolymer obtained by copolymerizing a maleimide derivative and a styrene derivative with use of an alkyl borane or a boron compound as a polymerization initiator; and a thermosetting resin composition.

公开(公告)号：US20160042836A1

公开(公告)日：2016-02-11

申请号：US14813367

申请日：2015-07-30

Applicant: Hitachi, Ltd.

Inventor： Yoshiaki OKABE ,  Kotaro ARAYA ,  Takahito MURAKI ,  Satoru AMOU ,  Tadashi ARAI

IPC: H01B7/29 ,  H01B13/14 ,  H01B3/04 ,  H01B3/40 ,  H01B3/28

CPC classification number: H01B7/292 ,  H01B3/04 ,  H01B3/28 ,  H01B3/40 ,  H01B13/143 ,  H01B13/145

Abstract: Provided are an insulated wire which is excellent in heat resistance and pressure resistance, and a rotary electric machine which uses the same. An insulated wire includes an insulating resin layer that is formed on an outer periphery of a conductor, in which the insulating resin layer has a thermoplastic phenoxy resin, an epoxy resin, a cross-linking agent, an inorganic filler, and fine rubber particles.

Abstract translation: 提供耐热性和耐压性优异的绝缘线，以及使用该绝缘线的旋转电机。 绝缘线包括绝缘树脂层，其形成在导体的外周上，其中绝缘树脂层具有热塑性苯氧树脂，环氧树脂，交联剂，无机填料和细橡胶颗粒。