公开(公告)号：US10465089B2

公开(公告)日：2019-11-05

申请号：US16124987

申请日：2018-09-07

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kouji Morita ,  Hikari Murai ,  Shin Takanezawa ,  Yasuo Inoue ,  Kazunaga Sakai

IPC: C09D163/00 ,  C08J5/24 ,  C08G59/24 ,  C08G59/50 ,  H05K1/03 ,  B32B5/02 ,  B32B15/14 ,  H01L23/498

Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

公开(公告)号：US10907029B2

公开(公告)日：2021-02-02

申请号：US16318409

申请日：2017-07-19

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takao Tanigawa ,  Tetsuroh Irino ,  Minoru Kakitani ,  Kouji Morita

IPC: B32B3/00 ,  C08K5/524 ,  C08K5/372 ,  B32B27/34 ,  H05K1/03 ,  B32B5/28 ,  C08L35/00 ,  B32B15/08 ,  C08K5/49 ,  C08K3/22 ,  C08J5/24 ,  C08K5/523 ,  C08K5/5313 ,  H05K1/02

Abstract: The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.

公开(公告)号：US11377546B2

公开(公告)日：2022-07-05

申请号：US16318726

申请日：2017-07-18

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takao Tanigawa ,  Tetsuroh Irino ,  Minoru Kakitani ,  Kouji Morita

IPC: C08L39/04 ,  B32B15/08 ,  C08J5/18 ,  H05K1/03 ,  C08K5/3415 ,  C08L35/00 ,  B32B27/34 ,  C08L101/00

Abstract: The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.