公开(公告)号：US10662279B2

公开(公告)日：2020-05-26

申请号：US16079840

申请日：2016-08-25

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yuka Yoshida ,  Kenji Tanaka ,  Hideyuki Katagi ,  Yoshihiro Amano ,  Shinichi Kosugi ,  Haruaki Sue ,  Yoshitaka Takezawa

IPC分类号： C08G59/24 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08L61/12 ,  C08L63/00 ,  C08G59/62 ,  C08K3/38 ,  C08K5/54 ,  C08L63/04 ,  C08K5/544 ,  C08K5/101 ,  C08K5/5415

摘要： Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.