公开(公告)号：US20230411875A1

公开(公告)日：2023-12-21

申请号：US18128847

申请日：2023-03-30

申请人： Hitachi Energy Switzerland AG

发明人： Milad MALEKI ,  Dominik TRUESSEL ,  Fabian FISCHER ,  Lluis SANTOLARIA

IPC分类号： H01R12/52 ,  H01R43/20

CPC分类号： H01R12/523 ,  H01R43/205

摘要： A power module comprising at least one module component is provided. The power module has a side surface. The side surface of the power module comprises positioning structures. At least one of the positioning structures has a geometrical form configured for receiving an alignment tool and further configured for vertically moving the power module when sliding the alignment tool along a lateral direction. Moreover, an alignment tool and a method using the alignment tool for positioning and aligning the power module are provided.

公开(公告)号：US20230335456A1

公开(公告)日：2023-10-19

申请号：US18121911

申请日：2023-03-15

申请人： Hitachi Energy Switzerland AG

发明人： Lluis SANTOLARIA ,  Milad MALEKI ,  Fabian FISCHER

IPC分类号： H01L23/367 ,  H01L21/56 ,  H01L23/473

CPC分类号： H01L23/3675 ,  H01L21/56 ,  H01L23/473

摘要： A effective lower flow direction comprises power module and a housing that is arranged on an upper surface of the power module defining an upper flow section for liquid cooling of the power module in between. The upper flow section comprises an inlet, an outlet and a given upper flow path in between defining an effective upper flow direction. Further, a cooling unit is arranged on the lower surface of the power module defining a lower flow section for liquid cooling of the power module in between. The lower flow section comprises an inlet, an outlet and a given lower flow path in between defining an effective lower flow direction, such that during operation a coolant flows through the upper and the lower flow section providing a double-sided liquid cooling of the power module. The effective upper flow direction is different from the effective lower flow direction.

公开(公告)号：US20240096746A1

公开(公告)日：2024-03-21

申请号：US18038545

申请日：2021-11-24

申请人： Hitachi Energy Switzerland AG

发明人： Lluis SANTOLARIA ,  Samuel HARTMANN ,  Milad MALEKI ,  Dominik TRUESSEL ,  Harald BEYER

IPC分类号： H01L23/473

CPC分类号： H01L23/473

摘要： A power semiconductor component with



power semiconductor modules connected to a cooling structure, and a cooling chamber having an inlet and outlet port, and adapted for a flow direction of a coolant substance from the inlet port to the outlet port, each of the cooling structures provided within the cooling chamber consecutively in direction of the flow direction forming a flow resistance region in the cooling chamber, the cooling chamber comprises at least a bypass region connected in parallel to at least one of the at least two flow resistance regions being closer to the inlet port, and is adapted for a flow rate of the at least one flow resistance region, which is connected in parallel to the bypass region, closer to the inlet port being smaller than a flow rate of one of the at least two flow resistance regions closer to the outlet port.

公开(公告)号：US20240266250A1

公开(公告)日：2024-08-08

申请号：US18564532

申请日：2022-04-20

申请人： HITACHI ENERGY SWITZERLAND AG

发明人： Lluis SANTOLARIA ,  Dominik TRUESSEL ,  Harald BEYER

IPC分类号： H01L23/40 ,  H01L21/48

CPC分类号： H01L23/4006 ,  H01L21/4871 ,  H01L2023/4087

摘要： A clamping element (9) is specified configured to be pressed to a baseplate (2) of at least one power semiconductor module (1) comprising a mold (4), comprising—at least one contact area (10) being configured to be in direct contact to at least one clamping area (7) of the baseplate (2) being free of the mold (4), and—at least one recess (11) provided in the baseplate, wherein—the recess (11) and the contact area (10) are configured to face the baseplate. Further, a method for producing a power semiconductor device is specified.