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公开(公告)号:US20220170161A1
公开(公告)日:2022-06-02
申请号:US17454403
申请日:2021-11-10
发明人: Jin Gyu IM , Woon Suk JUNG , Jong Uk KIM , Jin Gyu LEE , Duk Haeng LEE
摘要: Provided is a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles. The plating apparatus includes a hybrid paddle disposed in front of a substrate in a plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.