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1.发明公开公开(公告)号：US20230151504A1
公开(公告)日：2023-05-18
申请号：US17935410
申请日：2022-09-26
发明人： Woon Suk JUNG , Jong Uk KIM , Jin Gyu LEE
摘要： Provided is an electroplating solution of tin or a tin alloy in which the thickness variation of wafer bumps is maintained at a low level even in various changes of plating conditions and thus the mass productivity is improved. The electroplating solution of tin or a tin alloy may include tin ions as metal ions, a conductive salt, a carboxylic acid as a structure refiner, and a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent.
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公开(公告)号：US20220170161A1
公开(公告)日：2022-06-02
申请号：US17454403
申请日：2021-11-10
发明人： Jin Gyu IM , Woon Suk JUNG , Jong Uk KIM , Jin Gyu LEE , Duk Haeng LEE
摘要： Provided is a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles. The plating apparatus includes a hybrid paddle disposed in front of a substrate in a plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.
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