公开(公告)号：US20240080610A1

公开(公告)日：2024-03-07

申请号：US18272934

申请日：2022-08-25

Applicant: Beijing Honor Device Co., Ltd.

Inventor： Jinhua LIU ,  Jianfei CHU ,  Yunhai LI ,  Chuanguo WANG

IPC: H04R1/24 ,  H04R1/10 ,  H04R9/06

CPC classification number: H04R1/24 ,  H04R1/1016 ,  H04R1/1075 ,  H04R9/06

Abstract: A speaker module and a headset (100) are provided. The speaker module is used for the headset (100). The headset (100) includes a housing (1). The speaker module includes a first speaker unit (4a) and a second speaker unit (4b). An outer surface of a first diaphragm assembly (4a21) of the first speaker unit (4a) faces a first side, the second speaker unit (4b) is located on one side of a circumferential direction of the first speaker unit (4a), the second speaker unit (4b) emits sound toward the first side, and sound emission frequency of the second speaker unit (4b) is greater than sound emission frequency of the first speaker unit (4a).

公开(公告)号：US20240179858A1

公开(公告)日：2024-05-30

申请号：US17790726

申请日：2022-01-18

Applicant: HONOR DEVICE CO., LTD.

Inventor： Jiuliang GAO ,  Kangle XUE ,  Yan WANG ,  Chuanguo WANG

IPC: H05K5/02 ,  H04M1/02 ,  H04M1/03

CPC classification number: H05K5/0215 ,  H04M1/0283 ,  H04M1/035

Abstract: A housing comprises a first housing with a first through-hole, a second housing with a second through-hole, a decoration part with a third through-hole, and a first breathable film. The first housing is disposed outside the second housing, and the decoration part is disposed on the first housing and covers the first through-hole. An orthographic projection of the third through-hole on the second housing is located outside an orthographic projection of the second through-hole on the second housing. A first gap exists between the decoration part and the second housing and is communicated with both the second through-hole and the third through-hole. The first breathable film is disposed on the second housing and covers the second through-hole.

公开(公告)号：US20240089650A1

公开(公告)日：2024-03-14

申请号：US18272495

申请日：2022-08-24

Applicant: Beijing Honor Device Co., Ltd.

Inventor： Chuanguo WANG ,  Yunhai LI ,  Dong WU ,  Chienfeng YEH ,  Yuanwu JIANG

IPC: H04R1/10 ,  H04R9/06 ,  H04R17/00

CPC classification number: H04R1/1075 ,  H04R1/1016 ,  H04R1/1041 ,  H04R9/06 ,  H04R17/00 ,  H04R2400/11

Abstract: Disclosed are a speaker module and an earphone. The speaker module includes a first speaker unit, a bracket, and a second speaker unit. The first speaker unit includes a basin frame and a wiring terminal. The wiring terminal is disposed on the basin frame. The bracket includes an electrically conductive portion. The second speaker unit is fastened to the basin frame by using the bracket. An electrode of the second speaker unit is electrically connected to the wiring terminal by using the electrically conductive portion.