公开(公告)号：US20230253431A1

公开(公告)日：2023-08-10

申请号：US18299550

申请日：2023-04-12

Applicant: HRL LABORATORIES, LLC

Inventor： Mark O'Masta ,  Jacob Hundley ,  Jensen Severance ,  Brian Hempe ,  Christopher Roper

IPC: H01L27/146

CPC classification number: H01L27/14632 ,  H01L27/14687

Abstract: An imaging sensor package including: an imaging sensor; and a patterned substrate coupled to a surface of the imaging sensor. The imaging sensor and the patterned substrate being curved. The patterned substrate having a petal-shaped patterned area having a first thickness and a base substrate having a second thickness, the first thickness being greater than the second thickness.