公开(公告)号：US12230659B1

公开(公告)日：2025-02-18

申请号：US17325107

申请日：2021-05-19

Applicant: HRL Laboratories, LLC

Inventor： Tobias A. Schaedler ,  Florian G. Herrault ,  Kevin Geary ,  Mark O'Masta ,  Kayleigh A. Porter ,  Minh B. Nguyen

IPC: H01L27/146

Abstract: An interposer for a curved detector. In some embodiments a system includes a curved array photodetector; a first readout integrated circuit, the first readout integrated circuit being substantially flat; and an interposer, between the photodetector and the first readout integrated circuit. The photodetector and the first readout integrated circuit may each have a plurality of electrical contacts. The interposer may include a first conductor connecting a first contact, of the plurality of electrical contacts of the photodetector, and a second contact, of the plurality of electrical contacts of the first readout integrated circuit.

公开(公告)号：US11862653B2

公开(公告)日：2024-01-02

申请号：US17111108

申请日：2020-12-03

Applicant: HRL LABORATORIES, LLC

Inventor： Mark O'Masta ,  Jacob Hundley ,  Eric Clough ,  Christopher Roper ,  Geoffrey McKnight

IPC: H01L27/146

CPC classification number: H01L27/14632 ,  H01L27/1462 ,  H01L27/14687

Abstract: An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.

公开(公告)号：US20210313374A1

公开(公告)日：2021-10-07

申请号：US17111108

申请日：2020-12-03

Applicant: HRL LABORATORIES, LLC

Inventor： Mark O'Masta ,  Jacob Hundley ,  Eric Clough ,  Christopher Roper ,  Geoffrey McKnight

IPC: H01L27/146

Abstract: An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.

公开(公告)号：US11787746B1

公开(公告)日：2023-10-17

申请号：US17520154

申请日：2021-11-05

Applicant: HRL Laboratories, LLC

Inventor： Mark O'Masta ,  Phuong Bui ,  Tobias Schaedler

IPC: C04B35/80 ,  C04B35/628 ,  C04B111/40

CPC classification number: C04B35/80 ,  C04B35/628 ,  C04B2111/40 ,  C04B2235/5276

Abstract: Some variations provide a pre-ceramic matrix composite comprising: a precursor pre-ceramic matrix; reinforcing elements disposed within the precursor pre-ceramic matrix; and a compressible material disposed on the surface of the reinforcing elements and interposed between the reinforcing elements and the precursor pre-ceramic matrix. Other variations provide a ceramic matrix composite comprising: a ceramic matrix; reinforcing elements disposed within the ceramic matrix; and a compressed material disposed on the surface of the reinforcing elements and interposed between the reinforcing elements and the matrix. The coating of compressible material prevents cracking during processing because the coating absorbs stresses associated with volumetric shrinkage of the ceramic matrix during densification, thereby reducing the stresses at the interface between the reinforcing elements and the ceramic matrix. Methods of fabricating ceramic matrix composites using the principles of the invention are disclosed. Methods include pyrolysis of pre-ceramic polymers, sintering of pre-ceramic materials, and sol-gel processing.

公开(公告)号：US20230253431A1

公开(公告)日：2023-08-10

申请号：US18299550

申请日：2023-04-12

Applicant: HRL LABORATORIES, LLC

Inventor： Mark O'Masta ,  Jacob Hundley ,  Jensen Severance ,  Brian Hempe ,  Christopher Roper

IPC: H01L27/146

CPC classification number: H01L27/14632 ,  H01L27/14687

Abstract: An imaging sensor package including: an imaging sensor; and a patterned substrate coupled to a surface of the imaging sensor. The imaging sensor and the patterned substrate being curved. The patterned substrate having a petal-shaped patterned area having a first thickness and a base substrate having a second thickness, the first thickness being greater than the second thickness.