公开(公告)号：US11371823B1

公开(公告)日：2022-06-28

申请号：US16829859

申请日：2020-03-25

Applicant: HRL LABORATORIES, LLC

Inventor： Chia-Ming Chang ,  Hyok J. Song ,  David Shahan ,  Geoffrey McKnight

IPC: G01L1/12 ,  G01B7/24

Abstract: A wireless radio-frequency identification (RFID) strain sensor including: a substrate; an antenna on the substrate; and an integrated circuit on the substrate and electrically connected to the antenna. At least one of the substrate and the antenna includes a magnetoelastic material.

公开(公告)号：US11862653B2

公开(公告)日：2024-01-02

申请号：US17111108

申请日：2020-12-03

Applicant: HRL LABORATORIES, LLC

Inventor： Mark O'Masta ,  Jacob Hundley ,  Eric Clough ,  Christopher Roper ,  Geoffrey McKnight

IPC: H01L27/146

CPC classification number: H01L27/14632 ,  H01L27/1462 ,  H01L27/14687

Abstract: An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.

公开(公告)号：US20210313374A1

公开(公告)日：2021-10-07

申请号：US17111108

申请日：2020-12-03

Applicant: HRL LABORATORIES, LLC

Inventor： Mark O'Masta ,  Jacob Hundley ,  Eric Clough ,  Christopher Roper ,  Geoffrey McKnight

IPC: H01L27/146

Abstract: An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.