-
公开(公告)号：US11457535B2
公开(公告)日：2022-09-27
申请号：US17099793
申请日：2020-11-17
申请人： HTC Corporation
摘要： A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.
-
公开(公告)号：US20190281716A1
公开(公告)日：2019-09-12
申请号：US16424516
申请日：2019-05-29
申请人： HTC Corporation
摘要： A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.
-
3.发明申请公开(公告)号：US20140286502A1
公开(公告)日：2014-09-25
申请号：US13848752
申请日：2013-03-22
申请人： HTC Corporation
发明人： Jen-De Chen , Chen-Yu Wang , Chien-Hung Lin
IPC分类号： H04R3/12
CPC分类号： H04R3/12 , H04R2460/07 , H04R2499/11 , H04S7/30
摘要： An audio playback system used in a handheld electronic device is provided. The audio playback system comprises an audio interface, a control module, an audio processing module and at least two audio playback modules. The audio interface receives a digital audio stream. The control module generates audio channel mapping information. The audio processing module processes the digital audio stream to convert the digital audio stream to a plurality of analog audio signals and performs a channel switching process according to the audio channel mapping information. The audio playback modules output the analog audio signals after the channel switching process.
摘要翻译： 提供了一种在手持电子设备中使用的音频播放系统。 音频播放系统包括音频接口，控制模块，音频处理模块和至少两个音频回放模块。 音频接口接收数字音频流。 控制模块生成音频通道映射信息。 音频处理模块处理数字音频流以将数字音频流转换为多个模拟音频信号，并根据音频通道映射信息执行频道切换过程。 音频播放模块在频道切换过程之后输出模拟音频信号。
-
公开(公告)号：US20140284096A1
公开(公告)日：2014-09-25
申请号：US14183534
申请日：2014-02-19
申请人： HTC Corporation
IPC分类号： H05K5/04
CPC分类号： H05K5/0247 , G06F1/1626 , G06F1/1656 , H04M1/0283 , H05K5/0004 , H05K5/0217 , H05K5/03 , H05K5/04 , Y10T29/49
摘要： A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.
摘要翻译： 提供一种制造电子设备的壳体的方法，包括以下步骤。 提供了金属外壳，其中金属外壳具有内表面和与内表面相对的外表面。 多个孔形成在金属外壳的内表面上。 在金属外壳的内表面上形成非导电层，并且非导电层的一部分延伸到孔中。 金属外壳的外表面被染色以形成电子设备的外壳。 还提供了电子设备的外壳。
-
公开(公告)号：US10356923B2
公开(公告)日：2019-07-16
申请号：US14990800
申请日：2016-01-08
申请人： HTC Corporation
摘要： A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.
-
公开(公告)号：US09655261B2
公开(公告)日：2017-05-16
申请号：US14183534
申请日：2014-02-19
申请人： HTC Corporation
CPC分类号： H05K5/0247 , G06F1/1626 , G06F1/1656 , H04M1/0283 , H05K5/0004 , H05K5/0217 , H05K5/03 , H05K5/04 , Y10T29/49
摘要： A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.
-
公开(公告)号：US20160120052A1
公开(公告)日：2016-04-28
申请号：US14990800
申请日：2016-01-08
申请人： HTC Corporation
CPC分类号： H05K5/0247 , G06F1/1626 , G06F1/1656 , H04M1/0283 , H05K5/0004 , H05K5/0217 , H05K5/03 , H05K5/04 , Y10T29/49
摘要： A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.
摘要翻译： 提供了一种包括金属壳体和第一非导电间隔件的电子设备的壳体。 金属壳体具有内表面和与内表面相对的外表面，金属外壳的外表面被染色，内表面基本上是凹陷结构，并且金属外壳具有连通内表面和 外表面，其中所述金属外壳还包括至少一个连接端子。 第一非导电间隔件，设置在金属壳体的第一间隙中。
-
公开(公告)号：US20230403508A1
公开(公告)日：2023-12-14
申请号：US18185403
申请日：2023-03-17
申请人： HTC Corporation
发明人： Sung Jen Wang , Chien-Hung Lin
摘要： A speaker module is adapted to be configured to a wearable device. The speaker module includes an enclosure and a driving unit. The driving unit is used to generate sound. The enclosure contains the driving unit. A sound sum of the sound output from a front opening, a first rear opening and a second rear opening of the enclosure has directivity. The connection vectors and the inverse vector of the connection normal vector defined by these openings are added to form a combined vector. A unit vector of the combination vector and a unit vector of a front normal vector facing outwards of the front opening are added to form a sum vector. The direction of the sum vector is the direction of the sound sum.
-
公开(公告)号：US20230171556A1
公开(公告)日：2023-06-01
申请号：US17539209
申请日：2021-12-01
申请人： HTC Corporation
发明人： Yen-Chieh Wang , Li-Hsun Chang , Sung Jen Wang , Chien-Hung Lin
CPC分类号： H04S7/301 , H04R5/04 , H04R3/005 , H04S2420/01 , H04S2400/11
摘要： The disclosure provides a method and a host for adjusting audio of speakers, and a computer readable medium. The method includes: controlling a far-field speaker to play a first audio signal; controlling an audio receiver to receive the first audio signal from the far-field speaker and accordingly positioning a speaker location of the far-field speaker; establishing a first hearing transfer function related to the far-filed speaker based on the speaker location of the far-filed speaker; controlling the far-field speaker to play a second audio signal based on a second hearing transfer function; controlling the audio receiver to receive the second audio signal and accordingly estimating a first reference hearing volume; obtaining a second reference hearing volume corresponding to a first near-field speaker; and adjusting a first volume of the far-field speaker based on the first reference hearing volume and the second reference hearing volume.
-
公开(公告)号：US10952341B2
公开(公告)日：2021-03-16
申请号：US16896234
申请日：2020-06-09
申请人： HTC Corporation
摘要： A casing of an electronic device including a metallic housing, a first non-conductive spacer and a second non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first non-conductive spacer is disposed the first gap, and the second non-conductive spacer is disposed in the second gap.
-
-
-
-
-
-
-
-
-
搜索结果
16 条记录 (耗时 0.014 秒)
