公开(公告)号：US20200323106A1

公开(公告)日：2020-10-08

申请号：US16911030

申请日：2020-06-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huan PENG ,  Gaoliang XIA

IPC: H05K7/20 ,  G06F1/20

Abstract: An air baffle component includes an air baffle rotationally connected to a housing of a device chassis having a module insertion port. The air baffle component also includes a level-1 elastic component. The air baffle component further includes a level-2 elastic component. The air baffle component additionally includes a connecting rod. The connecting rod includes a force-bearing rod rotationally connected to the housing of the device chassis between the air baffle and the module insertion port. The connecting rod also includes a pull rod connected to the force-bearing rode. The connecting rod further includes a baffle column on the pull rod. The level-1 elastic component provides a first elastic force for the force-bearing rod, so that the baffle column is caused to abut against a surface of the air baffle opposite to the module insertion port. The level-2 elastic component provides a second elastic force for the air baffle.

公开(公告)号：US20220110224A1

公开(公告)日：2022-04-07

申请号：US17552722

申请日：2021-12-16

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xinhu GONG ,  Gaoliang XIA

IPC: H05K7/20

Abstract: A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.

公开(公告)号：US20240389262A1

公开(公告)日：2024-11-21

申请号：US18785125

申请日：2024-07-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Dingfang LI ,  Hui JIA ,  Gaoliang XIA

IPC: H05K7/20

Abstract: A heat dissipation apparatus is provided. The apparatus includes: a cover plate, a flow distribution plate, and a heat dissipation member. A first flow inlet and outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet and outlet communicate with the flow inlet and outlet cavity respectively. The heat dissipation member includes a heat dissipation portion, where a heat dissipation flow channel is formed. A second flow inlet and second flow outlets are provided in the flow distribution plate, the second flow inlet communicates with the flow inlet cavity and the heat dissipation flow channel. The second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and communicate with the heat dissipation flow channel and the flow outlet cavity.

公开(公告)号：US20240164052A1

公开(公告)日：2024-05-16

申请号：US18418434

申请日：2024-01-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xinhu GONG ,  Gaoliang XIA

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20254 ,  H01L23/473 ,  H05K7/20272

Abstract: A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.

公开(公告)号：US20220015268A1

公开(公告)日：2022-01-13

申请号：US17486593

申请日：2021-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yiying JIAN ,  Dingfang LI ,  Xinhu GONG ,  Gaoliang XIA

IPC: H05K7/20

Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.