公开(公告)号：US20230215788A1

公开(公告)日：2023-07-06

申请号：US18183367

申请日：2023-03-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Wengang LUO ,  Zhaozheng HOU ,  Junhe WANG

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L25/07

CPC classification number: H01L23/49575 ,  H01L23/49562 ,  H01L23/3121 ,  H01L23/49568 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49579 ,  H01L25/072

Abstract: A power module (10) and a manufacturing method thereof are disclosed. The power module (10) includes a power assembly (11) and a drive board (12). The power assembly (11) includes a substrate (111), a power chip (112), and a package body (113). The power chip (112) is disposed on a mounting surface (1110) of the substrate (111). The package body (113) packages the power chip (112) on the substrate (111). The drive board (12) is disposed in the package body (113) and is located on a side, of the power chip (112), that backs the mounting surface (1110). The drive board (12) is electrically connected to the power chip (112). In the power module, a parasitic parameter between the drive board (12) and the power assembly (11) can be reduced, thereby improving electrical performance of the power module (10).