公开(公告)号：US20230170269A1

公开(公告)日：2023-06-01

申请号：US18159754

申请日：2023-01-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fankun WU ,  Yunfei QIAO ,  Junhe WANG

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/29 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/3121 ,  H01L23/49811 ,  H01L23/293 ,  H01L21/565 ,  H01L24/48 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/48225 ,  H01L2224/32225 ,  H01L2224/73265

Abstract: A power module is provided. The power module includes a substrate, and the substrate is used to carry components and pins of the power module. A circuit layer is disposed on the substrate, to complete an electrical connection between the carried components. The components and the pins are disposed on a same surface of the substrate, and the components and the pins are electrically connected by using the substrate. The power module further includes a sealing layer. The sealing layer is sleeved on the pins, the pins are partially exposed on a surface that is of the sealing layer and that faces away from a plastic packaging layer, and a space for accommodating the plastic packaging layer is formed between the sealing layer and the substrate.

公开(公告)号：US20230299018A1

公开(公告)日：2023-09-21

申请号：US18324329

申请日：2023-05-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chen KANG ,  Chao SHEN ,  Xiaojing LIAO ,  Junhe WANG

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/564 ,  H01L23/552 ,  H01L23/31 ,  H05K1/185 ,  H01L23/49822 ,  H05K2201/0206

Abstract: This application provides a package substrate and a communication device. The package substrate includes a package body, a first circuit layer, a second circuit layer, an electronic component, and a moisture-proof structure. The package body includes a top surface and a bottom surface that are oppositely disposed, the first circuit layer is disposed on the top surface of the package body, and the second circuit layer is disposed on the bottom surface of the package body. The electronic component is packaged inside the package body. The moisture-proof structure is disposed on the package body and is connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. According to technical solutions of this application, external water vapor can be prevented from entering the package substrate from a peripheral side of the package substrate, to effectively prevent moisture absorption.

公开(公告)号：US20230215788A1

公开(公告)日：2023-07-06

申请号：US18183367

申请日：2023-03-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Wengang LUO ,  Zhaozheng HOU ,  Junhe WANG

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L25/07

CPC classification number: H01L23/49575 ,  H01L23/49562 ,  H01L23/3121 ,  H01L23/49568 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49579 ,  H01L25/072

Abstract: A power module (10) and a manufacturing method thereof are disclosed. The power module (10) includes a power assembly (11) and a drive board (12). The power assembly (11) includes a substrate (111), a power chip (112), and a package body (113). The power chip (112) is disposed on a mounting surface (1110) of the substrate (111). The package body (113) packages the power chip (112) on the substrate (111). The drive board (12) is disposed in the package body (113) and is located on a side, of the power chip (112), that backs the mounting surface (1110). The drive board (12) is electrically connected to the power chip (112). In the power module, a parasitic parameter between the drive board (12) and the power assembly (11) can be reduced, thereby improving electrical performance of the power module (10).

公开(公告)号：US20230238315A1

公开(公告)日：2023-07-27

申请号：US18190388

申请日：2023-03-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yunfei QIAO ,  Fankun WU ,  Junhe WANG

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L23/3121 ,  H01L21/56 ,  H01L24/48

Abstract: The technology of this application relates to a semiconductor packaged structure, including a circuit board, a chip, a pin, and a plastic package body. The pin includes a connecting part and a pressfit, one end of the connecting part is welded to the circuit board, the other end is flush with a top surface of the plastic package body, the connecting part has a mounting hole, the pressfit is disposed in the mounting hole and is in an interference fit with the connecting part, the pressfit is exposed from the top surface of the plastic package body. Alternatively, the pin includes a pressfit, the plastic package body is provided with a mounting hole that runs through a plastic package body, the pressfit is provided in the mounting hole, one end of the pressfit is welded to the circuit board, the other end is exposed from the top surface of the plastic package body.

公开(公告)号：US20180308616A1

公开(公告)日：2018-10-25

申请号：US16022055

申请日：2018-06-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuping GONG ,  Zhaozheng HOU ,  Junhe WANG

IPC: H01F27/24 ,  H01L23/492 ,  H01F27/30 ,  H01F3/14

CPC classification number: H01F27/24 ,  H01F3/14 ,  H01F17/04 ,  H01F27/306 ,  H01L23/492 ,  H01L23/49822 ,  H01L23/50 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: A system in package module assembly is provided, and includes: a substrate (10), and a chip (12), an inductor (15), and an electrical element (17) that are electrically connected to the substrate. The substrate includes a first surface (111), a second surface (112) opposite to the first surface, and an accommodation groove (113). The accommodation groove passes through the second surface and the first surface. The inductor includes a magnetic core (151) and an inductive coil (153). The magnetic core includes a base (154) and a protrusion (155) disposed on an outer surface of the base. The outer surface on which the protrusion is disposed and that is of the base abuts on the second surface. The protrusion is accommodated in the accommodation groove. The inductive coil is disposed in the protrusion. A system in package module and an electronic device are further provided.