公开(公告)号：US20230300985A1

公开(公告)日：2023-09-21

申请号：US18325551

申请日：2023-05-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jie SUN ,  Ruiming MO ,  Xichen YANG ,  Yi XU

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K1/0209 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/10098 ,  H05K2201/10719

Abstract: Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other.