Multi-Node Server, Cabinet Server, and Blade Server

    公开(公告)号:US20230232564A1

    公开(公告)日:2023-07-20

    申请号:US18187008

    申请日:2023-03-21

    CPC classification number: H05K7/1487 G06F1/20 G06F1/187 G06F1/189

    Abstract: A multi-node server includes a plurality of nodes and a hard disk backplane. Each node includes a power supply module. The power supply module is built in the node. The hard disk backplane is connected to the plurality of nodes through a first connector. The power supply module of each node is connected to a power supply interface of another node through a second connector, where the first connector and the second connector are spaced apart, and air flowing from an air inlet of the multi-node server circulates through a spacing between the first connector and the second connector. A system backplane for connection is not arranged in the multi-node server, but is replaced with the first connector and the second connector with a relatively small volume.

    HARD DISK HOLDER, HARD DISK, AND ELECTRONIC DEVICE

    公开(公告)号:US20230230620A1

    公开(公告)日:2023-07-20

    申请号:US18190776

    申请日:2023-03-27

    CPC classification number: G11B33/12 G11B33/14 G11B33/08 G11B33/10

    Abstract: A hard disk holder includes an integrated sheet metal framework. The integrated sheet metal framework is a main body structure of the hard disk holder, and a head and a tail of the integrated sheet metal framework are clamped to form a closed framework. The integrated sheet metal framework specifically includes a first side plate, a head end plate, a second side plate, and a tail end plate that are formed by sheet metal and are disposed in sequence. An inner side of the first side plate and an inner side of the second side plate each have a limiting bulge, and the hard disk body has limiting holes. The limiting bulges adapt to the limiting holes. When the hard disk body is mounted to the hard disk holder, the limiting bulges extend into the limiting holes to form a limiting structure.

    Chip Apparatus and Electronic Device

    公开(公告)号:US20210327783A1

    公开(公告)日:2021-10-21

    申请号:US17360594

    申请日:2021-06-28

    Abstract: A chip apparatus and an electronic device, where the chip apparatus includes a housing and a chip assembly fastened to one side of inside of the housing. The chip apparatus further includes a heat sink disposed on an opposite side of the inside of the housing, and the heat sink is thermally connected to the chip assembly.

Patent Agency Ranking