Multi-modal field-programmable metamorphic sensor and signal acquisition system

    公开(公告)号:US11573106B2

    公开(公告)日:2023-02-07

    申请号:US17035671

    申请日:2020-09-28

    Abstract: A multi-modal field-programmable metamorphic sensor is provided. The metamorphic sensor has a multi-layer structure, including an upper electrode layer, a spacer layer, and a lower electrode layer. At least one of the upper electrode layer and the lower electrode layer is a sensor A. The spacer layer is disposed between the electrode layers. A sensor B is formed through forming a structure of electrode layer-spacer layer-electrode layer structure. When detecting an object, the measurement of different physical quantities of different objects is implemented through switching between the sensor A and the sensor B. The sensor serves as a single cell. Multiple single cells are combined to form a multi-cell sensor. A signal acquisition system for acquiring signal of the sensor is also provided.

    Laser stripping mass-transfer device and method for microdevices based on winding process

    公开(公告)号:US11031263B2

    公开(公告)日:2021-06-08

    申请号:US17041464

    申请日:2019-07-01

    Abstract: A laser stripping mass-transfer device includes a microdevice laser stripping transfer module, an auxiliary conveyor module, a transition conveyor module, a transfer conveyor module, a substrate carrier module, a microdevice filling module, a curing module, an encapsulation module and a substrate transportation module. The microdevice laser stripping transfer module is configured to implement detection and stripping of the microdevices. The auxiliary conveyor module is configured to adhere the stripped microdevices. The transition conveyor module is configured to pick up and transfer the microdevices to the transfer conveyor module. The transfer conveyor module is configured to pick up and transfer the microdevices to the substrate carrier module. The substrate carrier module is configured to feed the microdevices into the microdevice filling module, the curing module, the encapsulation module, and the substrate transportation module for filling, curing, encapsulating, loading and unloading.

    MULTI-MODAL FIELD-PROGRAMMABLE METAMORPHIC SENSOR AND SIGNAL ACQUISITION SYSTEM

    公开(公告)号:US20210181002A1

    公开(公告)日:2021-06-17

    申请号:US17035671

    申请日:2020-09-28

    Abstract: A multi-modal field-programmable metamorphic sensor is provided. The metamorphic sensor has a multi-layer structure, including an upper electrode layer, a spacer layer, and a lower electrode layer. At least one of the upper electrode layer and the lower electrode layer is a sensor A. The spacer layer is disposed between the electrode layers. A sensor B is formed through forming a structure of electrode layer—spacer layer—electrode layer structure. When detecting an object, the measurement of different physical quantities of different objects is implemented through switching between the sensor A and the sensor B. The sensor serves as a single cell. Multiple single cells are combined to form a multi-cell sensor. A signal acquisition system for acquiring signal of the sensor is also provided.

    LASER STRIPPING MASS-TRANSFER DEVICE AND METHOD FOR MICRODEVICES BASED ON WINDING PROCESS

    公开(公告)号:US20210013066A1

    公开(公告)日:2021-01-14

    申请号:US17041464

    申请日:2019-07-01

    Abstract: A laser stripping mass-transfer device includes a microdevice laser stripping transfer module, an auxiliary conveyor module, a transition conveyor module, a transfer conveyor module, a substrate carrier module, a microdevice filling module, a curing module, an encapsulation module and a substrate transportation module. The microdevice laser stripping transfer module is configured to implement detection and stripping of the microdevices. The auxiliary conveyor module is configured to adhere the stripped microdevices. The transition conveyor module is configured to pick up and transfer the microdevices to the transfer conveyor module. The transfer conveyor module is configured to pick up and transfer the microdevices to the substrate carrier module. The substrate carrier module is configured to feed the microdevices into the microdevice filling module, the curing module, the encapsulation module, and the substrate transportation module for filling, curing, encapsulating, loading and unloading.

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