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公开(公告)号：US20090231202A1
公开(公告)日：2009-09-17
申请号：US12259384
申请日：2008-10-28
IPC分类号： H01Q9/04
摘要： An antenna structure of an information communication terminal, the antenna structure including: a frame having a three dimensional shape; an antenna pattern formed in the frame; and a circuit lumped element mounted on a surface of the antenna pattern. In the antenna structure, an antenna is directly provided on the frame such that a sufficient antenna characteristic can be ensured in a small space, thereby realizing a slim and miniaturized information communication terminal.
摘要翻译： 一种信息通信终端的天线结构，所述天线结构包括：具有三维形状的框架; 形成在所述框架中的天线图案; 以及安装在天线图案的表面上的电路集总元件。 在天线结构中，在框架上直接设置天线，使得能够在小空间中确保足够的天线特性，从而实现纤薄且小型化的信息通信终端。
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公开(公告)号：US09041074B2
公开(公告)日：2015-05-26
申请号：US13531120
申请日：2012-06-22
CPC分类号： H01Q1/2283 , H01Q21/0025
摘要： A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.
摘要翻译： 一种多层天线包，包括：射频集成电路（RFIC）接口层，被配置为发送射频（RF）信号; 设置在RFIC界面层上的第一介电层; 共面波导层，其设置在所述第一介电层上并被配置为接收由RFIC层发射的RF信号; 设置在共面波导层上的第二电介质层; 以及天线部，其设置在所述第二电介质层上并且被配置为照射从所述共面波导层发送的信号。
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公开(公告)号：US09337526B2
公开(公告)日：2016-05-10
申请号：US13534542
申请日：2012-06-27
CPC分类号： H01Q1/2283 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683 , H01L2224/16225 , H01L2224/48227
摘要： An antenna-printed circuit board (PCB) package is provided. The antenna-PCB package includes a PCB; an antenna portion formed on an upper surface of the PCB and inside the PCB; and a radio frequency integrated circuit (RFIC) chip bonded to a lower surface of the PCB.
摘要翻译： 提供了天线印刷电路板（PCB）封装。 天线PCB封装包括PCB; 形成在PCB的上表面和PCB内部的天线部分; 和射频集成电路（RFIC）芯片，其结合到PCB的下表面。
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4.发明申请公开(公告)号：US20080129658A1
公开(公告)日：2008-06-05
申请号：US11946697
申请日：2007-11-28
申请人： Kwang-hyun Baek
发明人： Kwang-hyun Baek
IPC分类号： G09G3/28
CPC分类号： G09G3/2942 , G09G3/2965 , G09G2310/066 , G09G2320/043 , G09G2360/16
摘要： A method for driving a plasma display panel having discharge gaps formed by a plurality of first electrodes and a plurality of second electrodes, the method including: measuring a load ratio of an input video signal inputted to the plasma display panel; applying a greatest number of discharge pulses with a maximum gradient to the first electrodes and the second electrodes if the load ratio of the video signal is less than the threshold value; and reducing a luminance of the plasma display panel by gradually adjusting the gradient of at least one of the sustain discharge pulses to a lower inclination and/or declination level (or a gentle level).
摘要翻译： 一种用于驱动具有由多个第一电极和多个第二电极形成的放电间隙的等离子体显示面板的方法，所述方法包括：测量输入到等离子体显示面板的输入视频信号的负载比; 如果视频信号的负载比小于阈值，则对第一电极和第二电极施加最大梯度的最大数量的放电脉冲; 并且通过将至少一个维持放电脉冲的梯度逐渐调整到较低的倾斜度和/或偏角水平（或平缓的水平）来降低等离子体显示面板的亮度。
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