SEMICONDUCTOR MEMORY DEVICE
    1.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 有权
    半导体存储器件

    公开(公告)号:US20110305100A1

    公开(公告)日:2011-12-15

    申请号:US13152316

    申请日:2011-06-03

    IPC分类号: G11C5/14

    CPC分类号: G11C5/063 G11C5/025

    摘要: A semiconductor memory device including a plurality of layers each including a memory cell array and which are stacked over each other; and at least one power plane for supplying power to the layers. The power plane includes a region to which a power voltage is applied and a region to which a ground voltage is applied. The region to which a power voltage is applied is located adjacent to the region to which a ground voltage is applied, and forms a decoupling capacitor therebetween to decouple an influx of power noise to the layers or generation of power noise in the layers

    摘要翻译: 一种半导体存储器件,包括多个层,每个层包括存储单元阵列并彼此堆叠; 以及用于向层供电的至少一个电力平面。 电力平面包括施加电源电压的区域和施加接地电压的区域。 施加电源电压的区域位于与施加接地电压的区域相邻的位置处,并且在其间形成去耦电容器以将功率噪声流入到层中或在层中产生功率噪声

    SEMICONDUCTOR MEMORY DEVICE HAVING STACKED STRUCTURE INCLUDING RESISTOR-SWITCHED BASED LOGIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE HAVING STACKED STRUCTURE INCLUDING RESISTOR-SWITCHED BASED LOGIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME 有权
    具有堆叠结构的半导体存储器件,包括基于电阻开关的逻辑电路及其制造方法

    公开(公告)号:US20120063194A1

    公开(公告)日:2012-03-15

    申请号:US13224410

    申请日:2011-09-02

    IPC分类号: G11C11/00 H01L45/00

    摘要: Semiconductor memory device having a stacking structure including resistor switch based logic circuits. The semiconductor memory device includes a first conductive line that includes a first line portion and a second line portion, wherein the first line portion and the second line portion are electrically separated from each other by an intermediate region disposed between the first and second line portions, a first variable resistance material film that is connected to the first line portion and stores data, and a second variable resistance material film that controls an electrical connection between the first line portion and the second line portion.

    摘要翻译: 具有包括基于电阻器开关的逻辑电路的堆叠结构的半导体存储器件。 半导体存储器件包括第一导线,其包括第一线部分和第二线部分,其中第一线部分和第二线部分通过布置在第一线部分和第二线部分之间的中间区域彼此电分离, 连接到第一线部分并存储数据的第一可变电阻材料膜和控制第一线部分和第二线部分之间的电连接的第二可变电阻材料膜。