SEMICONDUCTOR MEMORY DEVICE HAVING STACKED STRUCTURE INCLUDING RESISTOR-SWITCHED BASED LOGIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE HAVING STACKED STRUCTURE INCLUDING RESISTOR-SWITCHED BASED LOGIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME 有权
    具有堆叠结构的半导体存储器件,包括基于电阻开关的逻辑电路及其制造方法

    公开(公告)号:US20120063194A1

    公开(公告)日:2012-03-15

    申请号:US13224410

    申请日:2011-09-02

    IPC分类号: G11C11/00 H01L45/00

    摘要: Semiconductor memory device having a stacking structure including resistor switch based logic circuits. The semiconductor memory device includes a first conductive line that includes a first line portion and a second line portion, wherein the first line portion and the second line portion are electrically separated from each other by an intermediate region disposed between the first and second line portions, a first variable resistance material film that is connected to the first line portion and stores data, and a second variable resistance material film that controls an electrical connection between the first line portion and the second line portion.

    摘要翻译: 具有包括基于电阻器开关的逻辑电路的堆叠结构的半导体存储器件。 半导体存储器件包括第一导线,其包括第一线部分和第二线部分,其中第一线部分和第二线部分通过布置在第一线部分和第二线部分之间的中间区域彼此电分离, 连接到第一线部分并存储数据的第一可变电阻材料膜和控制第一线部分和第二线部分之间的电连接的第二可变电阻材料膜。

    MEMORY DEVICE FOR MANAGING TIMING PARAMETERS
    2.
    发明申请
    MEMORY DEVICE FOR MANAGING TIMING PARAMETERS 有权
    用于管理时序参数的存储器件

    公开(公告)号:US20130039135A1

    公开(公告)日:2013-02-14

    申请号:US13569636

    申请日:2012-08-08

    IPC分类号: G11C7/22

    摘要: A method of performing write operations in a memory device including a plurality of banks is performed. Each bank includes two or more sub-banks including at least a first sub-bank and a second sub-bank. The method comprises: performing a first row cycle for writing to a first word line of the first sub-bank, the first row cycle including a plurality of first sub-periods, each sub-period for performing a particular action; and performing a second row cycle for writing to a first word line of the second sub-bank, the second row cycle including a plurality of second sub-periods of the same type as the plurality of first sub-periods. The first row cycle overlaps with the second row cycle, and a first type sub-period of the first sub-periods overlaps with a second type sub-period of the second sub-periods, the first type and second type being different types.

    摘要翻译: 执行在包括多个存储体的存储器件中执行写入操作的方法。 每个银行包括至少包括第一子银行和第二子银行的两个或多个子行。 该方法包括:执行第一行周期以写入第一子行的第一字线,第一行周期包括多个第一子周期,用于执行特定动作的每个子周期; 以及执行第二行周期以写入所述第二子行的第一字线,所述第二行周期包括与所述多个第一子周期相同类型的多个第二子周期。 第一行周期与第二行周期重叠,第一子周期的第一类型子周期与第二子周期的第二类型子周期重叠,第一类型和第二类型是不同类型。

    SEMICONDUCTOR MEMORY DEVICES AND SEMICONDUCTOR MEMORY SYSTEMS
    3.
    发明申请
    SEMICONDUCTOR MEMORY DEVICES AND SEMICONDUCTOR MEMORY SYSTEMS 有权
    半导体存储器件和半导体存储器系统

    公开(公告)号:US20120106281A1

    公开(公告)日:2012-05-03

    申请号:US13282830

    申请日:2011-10-27

    摘要: A semiconductor memory device includes at least one memory cell block and at least one connection unit. The at least one memory cell block has a first region including at least one first memory cell connected to a first bit line, and a second region including at least one second memory cell connected to a second bit line. The at least one connection unit is configured to selectively connect the first bit line to a corresponding bit line sense amplifier based on a first control signal, and configured to selectively connect the second bit line to the corresponding bit line sense amplifier via a corresponding global bit line based on a second control signal.

    摘要翻译: 半导体存储器件包括至少一个存储单元块和至少一个连接单元。 所述至少一个存储单元块具有包括连接到第一位线的至少一个第一存储单元的第一区域和包括连接到第二位线的至少一个第二存储器单元的第二区域。 所述至少一个连接单元被配置为基于第一控制信号选择性地将第一位线连接到对应的位线读出放大器,并且被配置为经由对应的全局位选择性地将第二位线连接到对应的位线读出放大器 基于第二控制信号。