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公开(公告)号：US20230262941A1
公开(公告)日：2023-08-17
申请号：US17674035
申请日：2022-02-17
Applicant: Hamilton Sundstrand Corporation (HSC)
Inventor： Alexander Trotman , Josh Kamp , Judy Schwartz , Robert DeFelice , Michael Doe, JR. , Anthony Matthew DeLugan
CPC classification number: H05K7/205 , H05K7/20545 , H05K7/1404
Abstract: An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.
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Patent Agency Ranking
公开(公告)号：US20230345676A1
公开(公告)日：2023-10-26
申请号：US17728653
申请日：2022-04-25
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Judy Schwartz , Josh Kamp , Robert J. DeFelice , Michael Doe, Jr. , Anthony Matthew DeLugan
CPC classification number: H05K7/20636 , H05K7/1461 , H05K7/1404 , H05K7/205
Abstract: An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.
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公开(公告)号：US12075587B2
公开(公告)日：2024-08-27
申请号：US17673992
申请日：2022-02-17
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Josh Kamp , Judy Schwartz , Robert DeFelice , Michael Doe, Jr. , Anthony Matthew DeLugan
CPC classification number: H05K7/1404 , H05K7/2039 , H05K7/20545
Abstract: An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.
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公开(公告)号：US11839061B2
公开(公告)日：2023-12-05
申请号：US17728653
申请日：2022-04-25
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Judy Schwartz , Josh Kamp , Robert J. DeFelice , Michael Doe, Jr. , Anthony Matthew DeLugan
CPC classification number: H05K7/20636 , H05K7/1404 , H05K7/1461 , H05K7/205
Abstract: An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.
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公开(公告)号：US11825633B2
公开(公告)日：2023-11-21
申请号：US17674035
申请日：2022-02-17
Applicant: Hamilton Sundstrand Corporation (HSC)
Inventor： Alexander Trotman , Josh Kamp , Judy Schwartz , Robert DeFelice , Michael Doe, Jr. , Anthony Matthew DeLugan
CPC classification number: H05K7/205 , H05K7/1404 , H05K7/20545
Abstract: An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.
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公开(公告)号：US20230262917A1
公开(公告)日：2023-08-17
申请号：US17673992
申请日：2022-02-17
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Josh Kamp , Judy Schwartz , Robert DeFelice , Michael Doe, JR. , Anthony Matthew DeLugan
CPC classification number: H05K7/1404 , H05K7/2039 , H05K7/20545
Abstract: An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.
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