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    DEBRIS-RESISTANT COOLING PATH
    3.
    发明公开
    DEBRIS-RESISTANT COOLING PATH 审中-公开

    公开(公告)号：US20240074089A1

    公开(公告)日：2024-02-29

    申请号：US17821557

    申请日：2022-08-23

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Alexander Trotman ,  Kenneth J. Trotman

    IPC: H05K7/20

    CPC classification number: H05K7/20145

    Abstract: An electronic assembly includes one or more electronic components and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. The cooling airflow outlet is downward facing toward the vertically bottom surface such that the cooling airflow flows out of the cooling airflow outlet a downward direction toward the vertically bottom surface.

    INTEGRATED COOLING MOUNT
    5.
    发明申请
    INTEGRATED COOLING MOUNT 审中-公开

    公开(公告)号：US20200251406A1

    公开(公告)日：2020-08-06

    申请号：US16263891

    申请日：2019-01-31

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Alexander Trotman

    IPC: H01L23/467 ,  H01L23/40 ,  F04D29/70 ,  F04D29/52 ,  F04D29/54

    Abstract: A cooling mount for supporting an electronic assembly includes a chassis having air inlet ports, at least one of which is on the front, and one or more cooling fans located in either the interior region or in apertures in the top. The cooling fans are configured to draw external air through the air inlet ports into the interior region and to discharge air from the interior region out through the top toward the electronic assembly. The chassis width is greater than the height, and the chassis depth is also greater than the height. The cooling mount can either be attached to, or integrally formed with, the electronic assembly. In some embodiments, the cooling fans can discharge air out though cooling ports located on the top, near the sides, toward external heat sinks on the electronic assembly.

    Integrated card-guide adapter heat sink
    6.
    发明授权
    Integrated card-guide adapter heat sink 有权

    公开(公告)号：US10426054B1

    公开(公告)日：2019-09-24

    申请号：US16218130

    申请日：2018-12-12

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Alexander Trotman ,  Kenneth Trotman

    IPC: H05K7/14 ,  H05K7/20 ,  H05K1/02 ,  G06F1/18

    Abstract: An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.

    AUTO-DISCHARGE FOR CAPACITIVE DEVICES
    7.
    发明申请
    AUTO-DISCHARGE FOR CAPACITIVE DEVICES 有权

    公开(公告)号：US20250105655A1

    公开(公告)日：2025-03-27

    申请号：US18371807

    申请日：2023-09-22

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Steven A. Avritch ,  Michael A. Wilson ,  Alexander Trotman

    IPC: H02J7/34 ,  H01R12/73 ,  H02J7/00

    Abstract: A capacitive system includes a module circuit card assembly including a first modular keying and alignment mechanism and a second modular keying and alignment mechanism. The first and second modular keying and alignment mechanisms are configured for mechanical alignment and electrical connection with a backplane circuit card assembly (CCA). A capacitor is mounted to the module circuit card assembly and is electrically connected to each of the first and second modular keying and alignment mechanisms through a charge/discharge circuit. The circuit is configured to: charge the capacitor with the module circuit card assembly connected to the backplane CCA, discharge the capacitor with the module circuit card assembly connected to the backplane CCA for providing backup power, and discharge the capacitor through a bleed resistor of the circuit upon disconnection of the module circuit card assembly from the backplane CCA.

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