-
公开(公告)号：US11445603B2
公开(公告)日：2022-09-13
申请号：US16224023
申请日：2018-12-18
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
-
公开(公告)号：US20190124762A1
公开(公告)日：2019-04-25
申请号：US16224023
申请日：2018-12-18
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
IPC: H05K1/02 , H01L23/42 , H05K3/30 , H01L23/367 , H05K7/02
Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
-
Patent Agency Ranking
公开(公告)号：US20180116048A1
公开(公告)日：2018-04-26
申请号：US15332659
申请日：2016-10-24
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
CPC classification number: H05K1/0272 , H01L23/34 , H05K1/0203 , H05K1/0209 , H05K3/306 , H05K7/02 , H05K2201/06 , H05K2201/066 , H05K2201/10166 , H05K2203/17
Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
-
公开(公告)号：US10264668B2
公开(公告)日：2019-04-16
申请号：US15332659
申请日：2016-10-24
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
-
公开(公告)号：US20170176148A1
公开(公告)日：2017-06-22
申请号：US14970918
申请日：2015-12-16
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
CPC classification number: F41H5/023 , F41H5/00 , G06F1/1601 , G06F1/182
Abstract: An enclosure includes an enclosure body having an enclosure cavity, the enclosure body formed from a first material, and at least one ballistic tolerant plate disposed within the enclosure cavity to form a plurality of channel enclosures within the enclosure cavity, the at least one ballistic tolerant plate formed from a ballistic tolerant material.
-
公开(公告)号：US09696121B1
公开(公告)日：2017-07-04
申请号：US14970918
申请日：2015-12-16
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
CPC classification number: F41H5/023 , F41H5/00 , G06F1/1601 , G06F1/182
Abstract: An enclosure includes an enclosure body having an enclosure cavity, the enclosure body formed from a first material, and at least one ballistic tolerant plate disposed within the enclosure cavity to form a plurality of channel enclosures within the enclosure cavity, the at least one ballistic tolerant plate formed from a ballistic tolerant material.
-
公开(公告)号：US20150098190A1
公开(公告)日：2015-04-09
申请号：US13912808
申请日：2013-06-07
Applicant: Hamilton Sundstrand Corporation
Inventor： Luke T. Orsini , Charles V. DeSantis , Shun-Tien Lin , Kerry R. Querns , Kenneth J. Trotman , David Perley
CPC classification number: H05K7/20418 , G06F1/20 , H01L23/40 , H01L23/4006 , H01L23/433 , H01L23/4338 , H01L2023/4056 , H01L2023/4062 , H01L2023/4068 , H01L2924/0002 , H05K7/20509 , Y10T29/49826 , Y10T29/49963 , H01L2924/00
Abstract: Embodiments are directed to an apparatus comprising a thermal block coupled to an electronic device, a thermal strap coupled to the thermal block, and retention hardware coupled to the thermal strap and configured to retain the thermal block within the thermal strap when the apparatus is exposed to at least one variable environmental condition.
Abstract translation: 实施例涉及一种装置，其包括耦合到电子设备的热块，耦合到热块的热带，以及耦合到热带的保持硬件，并且被配置为当该装置暴露于热带时将热块保持在热带内 至少一个可变环境条件。
-
-
-
-
-
-
Search Results
7
records
(took 0.011 seconds)
