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公开(公告)号：US20230366630A1
公开(公告)日：2023-11-16
申请号：US18025929
申请日：2021-09-17
Applicant: Hanon Systems
Inventor： Ji Hun HAN , Byung Seon CHO
CPC classification number: F28D1/05366 , F28F9/0202 , F28F2270/00
Abstract: The present invention relates to a heat exchanger having a means for reducing thermal stress. An object of the present invention is to provide an integrated heat exchanger configured to cool two types of heat exchange media having different temperatures, the heat exchanger having a means for reducing thermal stress and having a flow distribution structure in a tank in order to effectively disperse thermal stress caused by a temperature difference.
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公开(公告)号：US20230341194A1
公开(公告)日：2023-10-26
申请号：US17800647
申请日：2021-02-19
Applicant: Hanon Systems
Inventor： Ji Hun HAN , Byung Seon CHO
CPC classification number: F28F9/0226 , F28D1/05366 , F28F9/0204 , F28F2225/08
Abstract: The present invention relates to a heat exchanger having a header structure for dispersing thermal stress. The purpose of the present invention is to provide a heat exchanger having a header structure for dispersing thermal stress, wherein the heat exchanger improves the structure of a tube insertion hole on a header so as to disperse as much thermal stress as possible, by focusing on the fact that thermal stress concentration mainly occurs in a tube nose.
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