公开(公告)号：US20060151754A1

公开(公告)日：2006-07-13

申请号：US11331194

申请日：2006-01-13

申请人： Hee Choi ,  Ha Jung ,  Jae Bae ,  Jong Kim ,  Jeong Yoon ,  Young Kim ,  Bae Kim

发明人： Hee Choi ,  Ha Jung ,  Jae Bae ,  Jong Kim ,  Jeong Yoon ,  Young Kim ,  Bae Kim

IPC分类号： H01B1/12

CPC分类号： G02B26/005 ,  G02B3/14

摘要： The invention provides a variable focus liquid lens using electrowetting, comprising a conductive first liquid and an insulating second liquid. At least one of the first liquid composed of electrolyte and the second liquid composed of insulating liquid contains a surfactant for reducing interfacial energy between the first and second liquids. An interfacial portion between the first and second liquids is gathered by surfactant to reduce driving voltage. The variable focus liquid lens according to the invention has about 50% lower driving voltage required for changing focus, ensuring stability of the two fluids.

摘要翻译： 本发明提供一种使用电润湿的可变焦点液体透镜，其包括导电的第一液体和绝缘的第二液体。 由电解质构成的第一液体和由绝缘液体构成的第二液体中的至少一种液体含有用于降低第一和第二液体之间的界面能的表面活性剂。 第一和第二液体之间的界面部分被表面活性剂收集以降低驱动电压。 根据本发明的可变焦点液体透镜具有改变聚焦所需的驱动电压低约50％，确保两种流体的稳定性。

公开(公告)号：US20070023873A1

公开(公告)日：2007-02-01

申请号：US11474382

申请日：2006-06-26

申请人： Sang Park ,  Yong Lee ,  Jin Hong ,  Bae Kim ,  Song Kim

发明人： Sang Park ,  Yong Lee ,  Jin Hong ,  Bae Kim ,  Song Kim

IPC分类号： H01L23/495

CPC分类号： H01L23/24 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a method for making a package structure having recession portion on the surface thereof. The method comprises: (a) providing a lead frame having a plurality of package units, each package unit having a plurality of leads and a die paddle; (b) providing an upper mold and a lower mold for clamping the lead frame, wherein the upper mold and the protruding block of the lower mold clamp the first portions of the leads so as to prevent molding compound bleeding to the upper surfaces of the first portions during mold filling operation, for improving the product yield; (c) injecting a molding compound between the upper mold and the lower mold, and forming a plurality of accommodation spaces; (d) attaching a plurality of chips onto the die paddles; (e) electrically connecting the chips to the first portions of the leads; (f) sealing the accommodation spaces; and (g) segregating the package units.

摘要翻译： 本发明涉及一种在其表面上制造具有凹陷部分的包装结构的方法。 该方法包括：（a）提供具有多个封装单元的引线框架，每个封装单元具有多个引线和管芯焊盘; （b）提供用于夹紧引线框架的上模具和下模具，其中上模具和下模具的突出块夹住引线的第一部分，以防止模塑复合物渗透到第一 注塑过程中的部分，用于提高产品的产量; （c）在上模和下模之间注入模塑料，并形成多个容纳空间; （d）将多个芯片附接到芯片上; （e）将芯片电连接到引线的第一部分; （f）密封住宿处所; 和（g）分离包装单元。