摘要:
The invention relates to a device (1) to disperse particles (12) onto a surface (46). To this aim, the device comprises a container (20) for the particles to be dispersed having at least one scatter opening (22) to dispend particles, a roller like distributing element (30) with a curved surface (36), and means (32) with which the roller like distributing element can be brought into vibration in longitudinal direction, such that particles (12) will be moved out of the scatter opening (22) over the curved surface (36) downwardly in the direction of the surface to be sprinkled.
摘要:
A motor, a clutch and a brake part are provided to drive a sewing machine. Two potentiometers are connected in series with individual ones of two respective switches and in parallel across two leads of a control cable which is connected to a control box. The control box supplies power to the motor under the control of a pedal. One of the switches is a contact switch controlled by a knee switch one of whose surfaces, swivelable about an axis, rests against the actuating member of the contact switch. The other switch is a position switch, such as a toggle switch, and is carried by another surface of the knee switch.
摘要:
The invention relates to a device (1) to disperse particles (12) onto a surface (46). To this aim, the device comprises a container (20) for the particles to be dispersed having at least one scatter opening (22) to dispend particles, a roller like distributing element (30) with a curved surface (36), and means (32) with which the roller like distributing element can be brought into vibration in longitudinal direction, such that particles (12) will be moved out of the scatter opening (22) over the curved surface (36) downwardly in the direction of the surface to be sprinkled.
摘要:
Crystal wafer rack structures composed of Si or SiC are produced by forming a tube-shaped body, for example, of Si, by pyrolytic deposition of silicon on a heated graphite mandrel from a suitable gaseous atmosphere with the removal of the mandrel without destroying the body and then machining the tube so that two separate wall portions are formed therefrom which extend parallel to the tube axis and are joined to one another by at least one bridging portion in the form of a closed arc between such wall portions and a plurality of uniformly spaced support grooves are provided in each of the wall portions for supporting the wafers during processing.