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    Electronic devices comprising an organic conductor and semiconductor as well as an intermediate buffer layer made of a crosslinked polymer
    3.
    发明授权
    Electronic devices comprising an organic conductor and semiconductor as well as an intermediate buffer layer made of a crosslinked polymer 有权
    包含有机导体和半导体的电子器件以及由交联聚合物制成的中间缓冲层

    公开(公告)号：US07901766B2

    公开(公告)日：2011-03-08

    申请号：US10570372

    申请日：2004-09-04

    申请人： David Christoph Müller ,  Nina Riegel ,  Frank Meyer ,  René Scheurich ,  Aurélie Falcou ,  Klaus Meerholz

    发明人： David Christoph Müller ,  Nina Riegel ,  Frank Meyer ,  René Scheurich ,  Aurélie Falcou ,  Klaus Meerholz

    IPC分类号： B32B27/06 ,  B32B27/26 ,  B32B33/00

    CPC分类号： H01L51/5088 ,  H01L51/0015 ,  H01L51/0035 ,  H01L51/0037 ,  H01L51/0039 ,  H01L51/0043 ,  H01L51/0059 ,  H01L2251/308 ,  Y02E10/549 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/31504 ,  Y10T428/31511

    摘要： The invention relates to electronic devices whose electronic properties can surprisingly be improved to a significant degree by inserting at least one crosslinkable polymeric buffer layer, preferably a cationically crosslinkable polymeric buffer layer, between the conductive doped polymer and the organic semiconductor layer. Particularly good properties are obtained with a buffer layer in which crosslinking is thermally induced, i.e. by raising the temperature to 50 to 250° C. Alternatively, crosslinking can be radiation-induced by adding a photoacid. Moreover, such a buffer layer can be advantageously applied by means of printing techniques, especially inkjet printing, as the ideal temperature for the thermal treatment is independent of the glass transition temperature of the material. This avoids having to rely on material that has a low molecular weight, making it possible to apply the layer by means of printing techniques. The next layer (the organic semiconductor layer) can also be applied with the aid of different printing techniques, particularly inkjet printing, because the buffer layer is rendered insoluble by the crosslinking process, thus preventing the buffer layer from solubilizing thereafter.

    摘要翻译： 本发明涉及通过在导电掺杂聚合物和有机半导体层之间插入至少一个可交联聚合物缓冲层，优选可阳离子交联的聚合物缓冲层，其电子性能可以惊人地改善到电子特性的电子设备。 通过热诱导交联的缓冲层，即通过将温度升高至50℃至250℃，可获得特别好的性能。或者，可以通过加入光致酸来辐射诱导交联。 此外，由于热处理的理想温度与材料的玻璃化转变温度无关，所以可以通过印刷技术，特别是喷墨印刷，有利地应用这种缓冲层。 这避免了依赖于具有低分子量的材料，使得可以通过印刷技术施加该层。 由于缓冲层通过交联过程变得不溶，因此也可借助于不同的印刷技术，特别是喷墨印刷来应用下一层（有机半导体层），从而防止缓冲层在此之后溶解。