公开(公告)号：US4606493A

公开(公告)日：1986-08-19

申请号：US589549

申请日：1984-03-14

申请人： Heinz Christoph ,  Jurgen Gamalski ,  Eduard Lenz ,  Ulrich Neumann ,  Reinhard von der Schmidt

发明人： Heinz Christoph ,  Jurgen Gamalski ,  Eduard Lenz ,  Ulrich Neumann ,  Reinhard von der Schmidt

IPC分类号： B23K31/02 ,  B23K1/008 ,  B23K1/08 ,  H05K3/34

CPC分类号： B23K1/008 ,  B23K1/085 ,  H05K3/3468 ,  H05K2203/086 ,  H05K2203/111

摘要： The invention concerns preventing oxidation of printed circuit board metal surfaces as a result of heat produced in a solder bath arrangement and reducing thermal stress defects from occurring in the circuit carrier being soldered. An enclosed reaction chamber is provided with the solder bath and supplied with a pressurized atmosphere of inert gas which gas seals the reaction chamber from ambient air. The inert gas is discharged from jets against the solder side (the connector post side) of the printed circuit boards at a point upstream of the solder bath and the inert gas is at a temperature substantially higher than the solder bath temperature.

摘要翻译： 本发明涉及防止印刷电路板金属表面的氧化，这是由于在焊料槽布置中产生的热量并且减少了在被焊接的电路载体中发生的热应力缺陷。 封闭的反应室设置有焊料槽，并且供应惰性气体的加压气体，气体将反应室与环境空气密封。 惰性气体在焊料浴上游的一个点处喷射到印刷电路板的焊料侧（连接器柱侧）上，并且惰性气体处于显着高于焊料槽温度的温度。