公开(公告)号：US06352190B1

公开(公告)日：2002-03-05

申请号：US09530561

申请日：2000-05-01

申请人： Heinz-Olaf Lucht ,  Tilman Schwinn ,  Hans-Peter Schmidt ,  Jens Tauchmann

发明人： Heinz-Olaf Lucht ,  Tilman Schwinn ,  Hans-Peter Schmidt ,  Jens Tauchmann

IPC分类号： B23K108

CPC分类号： B23K1/085 ,  B23K2101/42

摘要： A soldering apparatus has a solder container and a casing to accommodate a protective-gas atmosphere for soldering printed circuit boards. During transport of the circuit boards through a casing the circuit boards are brought into contact with a solder wave in the container. The casing has an inlet for printed circuit board on an inlet side and an outlet on its outlet side. In addition, the casing has a supply of non-oxidizing gas and an arrangement for admitting gas into the casing. The casing is designed as a modular construction kit having subassemblies and/or constructional elements which comprise an input tunnel, an entry tunnel, at least two covering elements, an outlet tunnel and a detachable connection on the solder container and/or the sub-assemblies and/or constructional elements to connect the sub-assemblies and/or constructional elements and the solder container.

摘要翻译： 焊接装置具有焊料容器和壳体，以适应用于焊接印刷电路板的保护气体气氛。 在电路板通过壳体运输期间，电路板与容器中的焊波接触。 壳体具有入口侧的印刷电路板入口和出口侧的出口。 此外，壳体具有非氧化气体的供给和用于将气体引入壳体的布置。 壳体被设计为具有子组件和/或结构元件的模块化构造套件，其包括输入隧道，入口隧道，至少两个覆盖元件，出口隧道和在焊料容器和/或子组件上的可拆卸连接 和/或结构元件以连接子组件和/或结构元件和焊料容器。

公开(公告)号：US5911355A

公开(公告)日：1999-06-15

申请号：US900804

申请日：1997-07-25

申请人： Jens Tauchmann ,  Tilman Schwinn ,  Heinz-Olaf Lucht

发明人： Jens Tauchmann ,  Tilman Schwinn ,  Heinz-Olaf Lucht

IPC分类号： B23K1/08 ,  H05K3/34 ,  B23K31/00

CPC分类号： H05K3/3468 ,  B23K1/085 ,  H01L2924/0002 ,  H05K2203/081

摘要： The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.

摘要翻译： 本发明涉及一种用于在印刷电路板（10）的表面上直接在焊接工厂中的印刷电路板的流焊期间通过焊料流动之后从其表面机械去除焊料珠（14）的方法。 为了确保焊料珠被机械地去除而不损坏印刷电路板，焊料珠（14）通过至少一个指向表面的冷气体喷射（50）机械去除。