ILLUMINATING UNIT
    1.
    发明申请
    ILLUMINATING UNIT 审中-公开
    照明单元

    公开(公告)号:US20080175022A1

    公开(公告)日:2008-07-24

    申请号:US11961768

    申请日:2007-12-20

    IPC分类号: F21V7/04

    摘要: Disclosed is an illuminating unit capable of effectively introducing light emitted from a light source into a light guide sheet to improve the brightness of light and emitting uniform color light. Light emitted from a light emitting diode of a light source unit is incident on a side surface of a light guide sheet. A spacer aligns the emission center of the light emitting diode with the center of the light guide sheet in the thickness direction thereof. The incident light travels in the light guide sheet and is then diffused in light emitting regions provided on the main surface of the light guide sheet. Then, the diffused light is emitted to the outside. In addition, light components emitted from a gap between the light emitting diode and the side surface of the light guide sheet or light components emitted from the upper surface of the light source unit to the outside are reflected to the light guide sheet by a cover member.

    摘要翻译: 公开了一种照明单元,其能够有效地将从光源发射的光引入导光片,以提高光的亮度并发出均匀的色光。 从光源单元的发光二极管发射的光入射在导光片的侧面。 间隔件将发光二极管的发射中心与导光片的中心在其厚度方向上对准。 入射光在导光片中行进,然后在设置在导光片的主表面上的发光区域中扩散。 然后,扩散的光被发射到外部。 此外,从发光二极管和导光片的侧面之间的间隙或从光源单元的上表面发射到外部的光分量发射的光分量通过盖构件反射到导光片 。

    PRINTED CIRCUIT BOARD
    2.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号:US20070238361A1

    公开(公告)日:2007-10-11

    申请号:US11697187

    申请日:2007-04-05

    申请人: Heishiro Fudo

    发明人: Heishiro Fudo

    IPC分类号: H01R13/66

    摘要: A printed circuit board comprises an insulating substrate, a plurality of wiring members disposed on the insulating substrate, and a coating member that covers the wiring members and the insulating substrate between the wiring members. The wiring members include Ag, and the coating member is formed of an acrylic glass and a curing agent comprising hexamethylene diisocyanate.

    摘要翻译: 印刷电路板包括绝缘基板,设置在绝缘基板上的多个布线构件和覆盖布线构件和布线构件之间的绝缘基板的涂覆构件。 布线构件包括Ag,并且涂层构件由丙烯酸玻璃和包含六亚甲基二异氰酸酯的固化剂形成。