公开(公告)号：US10005614B2

公开(公告)日：2018-06-26

申请号：US15053677

申请日：2016-02-25

申请人： Hemlock Semiconductor Corporation

发明人： Jonathan Patrick Berrie ,  John Victor Bucci ,  James C. Mundell ,  Traig William Savage

IPC分类号： B65G11/16 ,  B65G15/48 ,  B29D29/06 ,  B02C19/00 ,  B65G37/00 ,  B02C4/12

CPC分类号： B65G11/166 ,  B02C4/12 ,  B02C19/0056 ,  B29D29/06 ,  B65G15/48 ,  B65G37/00 ,  B65G2201/042

摘要： A method of reducing contamination in a silicon product includes: moving silicon pieces along a conveyance system, wherein the conveyance system comprises a liner having a polished surface finish with a surface roughness of less than or equal to 12 microinches; and moving the silicon pieces across the conveyance system, wherein the silicon pieces contain a reduced number of impurities as compared to silicon pieces in contact with a liner having an unpolished surface. A crushing tool includes: crushing tool elements configured to crush silicon into fragments, wherein the crushing tool elements comprise a surface comprising a polished surface finish with a surface roughness of less than or equal to 12 microinches. A conveyance system includes: a first conveyor discharged onto a second conveyor; wherein the first conveyor comprises a first liner and wherein the second conveyor comprises a second liner.

公开(公告)号：US20170246641A1

公开(公告)日：2017-08-31

申请号：US15053677

申请日：2016-02-25

申请人： Hemlock Semiconductor Corporation

发明人： Jonathan Patrick Berrie ,  John Victor Bucci ,  James C. Mundell ,  Traig William Savage

IPC分类号： B02C19/00 ,  B24B7/14 ,  B24B3/60 ,  B65G37/00

CPC分类号： B65G11/166 ,  B02C4/12 ,  B02C19/0056 ,  B29D29/06 ,  B65G15/48 ,  B65G37/00 ,  B65G2201/042

摘要： A method of reducing contamination in a silicon product includes: moving silicon pieces along a conveyance system, wherein the conveyance system comprises a liner having a polished surface finish with a surface roughness of less than or equal to 12 microinches; and moving the silicon pieces across the conveyance system, wherein the silicon pieces contain a reduced number of impurities as compared to silicon pieces in contact with a liner having an unpolished surface. A crushing tool includes: crushing tool elements configured to crush silicon into fragments, wherein the crushing tool elements comprise a surface comprising a polished surface finish with a surface roughness of less than or equal to 12 microinches. A conveyance system includes: a first conveyer discharged onto a second conveyer; wherein the first conveyer comprises a first liner and wherein the second conveyer comprises a second liner.