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公开(公告)号：US10005614B2
公开(公告)日：2018-06-26
申请号：US15053677
申请日：2016-02-25
Applicant: Hemlock Semiconductor Corporation
Inventor： Jonathan Patrick Berrie , John Victor Bucci , James C. Mundell , Traig William Savage
CPC classification number: B65G11/166 , B02C4/12 , B02C19/0056 , B29D29/06 , B65G15/48 , B65G37/00 , B65G2201/042
Abstract: A method of reducing contamination in a silicon product includes: moving silicon pieces along a conveyance system, wherein the conveyance system comprises a liner having a polished surface finish with a surface roughness of less than or equal to 12 microinches; and moving the silicon pieces across the conveyance system, wherein the silicon pieces contain a reduced number of impurities as compared to silicon pieces in contact with a liner having an unpolished surface. A crushing tool includes: crushing tool elements configured to crush silicon into fragments, wherein the crushing tool elements comprise a surface comprising a polished surface finish with a surface roughness of less than or equal to 12 microinches. A conveyance system includes: a first conveyor discharged onto a second conveyor; wherein the first conveyor comprises a first liner and wherein the second conveyor comprises a second liner.
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公开(公告)号：US10431447B2
公开(公告)日：2019-10-01
申请号：US15506483
申请日：2015-09-03
Applicant: Hemlock Semiconductor Corporation
Abstract: A polysilicon chip reclamation assembly includes a polysilicon cleaning apparatus configured to clean a plurality of bodies of polysilicon. Also included is a plurality of polysilicon chips generated from the bodies of polysilicon during cleaning thereof, wherein each of the plurality of polysilicon chips has a longest dimensional length ranging from 0.1 mm to 25.0 mm. Further included is a polysilicon apparatus drain line configured to route the plurality of polysilicon chips from the polysilicon cleaning apparatus to a main chip drain line, wherein the main chip drain line is oriented at a downward slope away from the polysilicon apparatus drain line. Yet further included is a fluid source fluidly coupled to the main chip drain line and configured to inject a fluid into the main chip drain line to drive the plurality of polysilicon chips through the main chip drain line.
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3.发明申请公开(公告)号：US20180226243A1
公开(公告)日：2018-08-09
申请号：US15506483
申请日：2015-09-03
Applicant: Hemlock Semiconductor Corporation
CPC classification number: H01L21/02079 , B08B3/08 , B08B3/14 , C30B29/06 , C30B35/007 , H01L21/67028 , H01L21/67051 , H01L21/67721 , H01L21/67784 , H01L23/48 , H01L2924/0002 , H01L2924/00
Abstract: A polysilicon chip reclamation assembly includes a polysilicon cleaning apparatus configured to clean a plurality of bodies of polysilicon. Also included is a plurality of polysilicon chips generated from the bodies of polysilicon during cleaning thereof, wherein each of the plurality of polysilicon chips has a longest dimensional length ranging from 0.1 mm to 25.0 mm. Further included is a polysilicon apparatus drain line configured to route the plurality of polysilicon chips from the polysilicon cleaning apparatus to a main chip drain line, wherein the main chip drain line is oriented at a downward slope away from the polysilicon apparatus drain line. Yet further included is a fluid source fluidly coupled to the main chip drain line and configured to inject a fluid into the main chip drain line to drive the plurality of polysilicon chips through the main chip drain line.
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公开(公告)号：US20170246641A1
公开(公告)日：2017-08-31
申请号：US15053677
申请日：2016-02-25
Applicant: Hemlock Semiconductor Corporation
Inventor： Jonathan Patrick Berrie , John Victor Bucci , James C. Mundell , Traig William Savage
CPC classification number: B65G11/166 , B02C4/12 , B02C19/0056 , B29D29/06 , B65G15/48 , B65G37/00 , B65G2201/042
Abstract: A method of reducing contamination in a silicon product includes: moving silicon pieces along a conveyance system, wherein the conveyance system comprises a liner having a polished surface finish with a surface roughness of less than or equal to 12 microinches; and moving the silicon pieces across the conveyance system, wherein the silicon pieces contain a reduced number of impurities as compared to silicon pieces in contact with a liner having an unpolished surface. A crushing tool includes: crushing tool elements configured to crush silicon into fragments, wherein the crushing tool elements comprise a surface comprising a polished surface finish with a surface roughness of less than or equal to 12 microinches. A conveyance system includes: a first conveyer discharged onto a second conveyer; wherein the first conveyer comprises a first liner and wherein the second conveyer comprises a second liner.
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