公开(公告)号：US20180067524A1

公开(公告)日：2018-03-08

申请号：US15562063

申请日：2015-04-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David A. Moore ,  John p. Franz ,  Wade D. Vinson

IPC: G06F1/20 ,  H05K7/20 ,  H01L23/467 ,  H01L23/40

CPC classification number: G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/40 ,  H01L23/467 ,  H01L2023/4062 ,  H05K7/20736

Abstract: In one implementation, a system for supplemental air cooling includes a heat sink mounted to a computing device, a supplemental cooling device coupled to the heat sink by a number of heat pipes, and a fan coupled to the supplemental cooling device.