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公开(公告)号：US10893630B2
公开(公告)日：2021-01-12
申请号：US15883230
申请日：2018-01-30
发明人： Harvey Lunsman , Steven Dean , Michael Scott
摘要： Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.
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公开(公告)号：US10813253B2
公开(公告)日：2020-10-20
申请号：US15834636
申请日：2017-12-07
发明人： Harvey Lunsman , Steven Dean , Michael Scott
IPC分类号： H05K7/20
摘要： Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.
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公开(公告)号：US10582645B1
公开(公告)日：2020-03-03
申请号：US16145625
申请日：2018-09-28
发明人： Benjamin Kufahl , Harvey Lunsman , Michael Scott
摘要： A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.
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公开(公告)号：US10561040B1
公开(公告)日：2020-02-11
申请号：US16154710
申请日：2018-10-08
发明人： Harvey Lunsman , Tahir Cader , Michael Scott
摘要： Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.
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公开(公告)号：US20190239387A1
公开(公告)日：2019-08-01
申请号：US15883230
申请日：2018-01-30
发明人： Harvey Lunsman , Steven Dean , Michael Scott
CPC分类号： H05K7/20272 , F28F2250/08 , G06F1/206 , G06F2200/201 , H05K7/20281
摘要： Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.
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6.发明申请公开(公告)号：US20230034486A1
公开(公告)日：2023-02-02
申请号：US17388412
申请日：2021-07-29
发明人： Michael Scott
摘要： Example implementations relate to a host electronic device configured for establishing a thermal contact between a heat generating component of a removable electronic device, and a cooling component of the host electronic device, when the removable electronic device is detachably connected to the host electronic device. The host electronic device includes a support structure, the cooling component, a driver, and an actuator. The cooling component is movably connected to the support structure. The driver is also movably connected to the support structure. The actuator is movably connected to the support structure and the driver. The actuator, upon contact by the removable device, causes a movement of the cooling component via the driver for establishing the thermal contact between the cooling component and the heat generating component.
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7.发明授权公开(公告)号：US11481009B1
公开(公告)日：2022-10-25
申请号：US17237529
申请日：2021-04-22
发明人： Michael Scott
摘要： Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.
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公开(公告)号：US10941892B2
公开(公告)日：2021-03-09
申请号：US15789741
申请日：2017-10-20
发明人： Michael Scott , Steven J. Dean , Harvey J. Lunsman
摘要： Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.
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公开(公告)号：US20180238480A1
公开(公告)日：2018-08-23
申请号：US15789741
申请日：2017-10-20
发明人： Michael Scott , Steven J. Dean , Harvey J. Lunsman
IPC分类号： F16L37/36 , F16L37/14 , F16L37/086
CPC分类号： F16L37/36 , F16L37/006 , F16L37/086 , F16L37/14 , F16L37/34 , F16L37/35 , F16L37/56
摘要： Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.
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公开(公告)号：US10955883B1
公开(公告)日：2021-03-23
申请号：US16653335
申请日：2019-10-15
发明人： John Franz , Robert Mascia , Harvey Lunsman , Steven Dean , Michael Scott
摘要： A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
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