公开(公告)号：US20180224910A1

公开(公告)日：2018-08-09

申请号：US15579921

申请日：2015-06-05

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Dave Mayer ,  Steven E. Hanzlik

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/02

CPC classification number: G06F1/206 ,  F28D15/0233 ,  G06F1/20 ,  H01L23/427 ,  H05K7/20145 ,  H05K7/20809

Abstract: In the examples provided herein, an apparatus has modules to be cooled during operation, where each module is coupled to a heatsink, and the heatsinks are coupled to a first surface of a thermally conductive plate. The modules are positioned along a direction from a first side of the plate toward an opposite side of the plate. The apparatus also has heat pipes coupled to a second surface of the plate to transport heat away from the modules during operation, where the heat pipes are positioned nonuniformly along the direction.

公开(公告)号：US10324506B2

公开(公告)日：2019-06-18

申请号：US15579921

申请日：2015-06-05

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Dave Mayer ,  Steven E. Hanzlik

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  H01L23/427

Abstract: In the examples provided herein, an apparatus has modules to be cooled during operation, where each module is coupled to a heatsink, and the heatsinks are coupled to a first surface of a thermally conductive plate. The modules are positioned along a direction from a first side of the plate toward an opposite side of the plate. The apparatus also has heat pipes coupled to a second surface of the plate to transport heat away from the modules during operation, where the heat pipes are positioned nonuniformly along the direction.