公开(公告)号：US20220253160A1

公开(公告)日：2022-08-11

申请号：US17628937

申请日：2019-09-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Alexander Williams ,  Hsiao-Jou Lin ,  Anthony Kaplanis ,  John Frederick

IPC: G06F3/0354 ,  G06F1/20 ,  G01K1/143 ,  G05D23/19

Abstract: In an example implementation according to aspects of the present disclosure, a mouse system comprising a plurality of temperature sensors, a thermoelectric device, and a processor. The processor receives a first input and second input from a first temperature sensor and second temperature sensor respectively. The first temperature sensor is in proximity to a users fingers, and the second temperature sensor is in proximity to a users palm. The processor activates the thermoelectric device based on the received first and second inputs. The processor receives a feedback from a user response and the feedback, the first input and second input are provided as input to a machine learning model.

公开(公告)号：US11789548B2

公开(公告)日：2023-10-17

申请号：US18005736

申请日：2020-07-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsiao-Jou Lin ,  Kuan-Ting Wu ,  Alexander Williams

IPC: G06F3/0354 ,  F25B21/02

CPC classification number: G06F3/03543 ,  F25B21/02 ,  F25B2321/021

Abstract: An input mouse may include a top button, a first wall rearward of the top button to underlie a palm of a user and a second wall forming an exterior of the input mouse. The first wall is formed from a material composition comprising a first polymer encapsulating thermally conductive particles. The second wall is formed from a thermally conductive material. A solid-state Peltier heat pump has a first face thermally coupled to the first wall and a second face thermally coupled to the second wall.

公开(公告)号：US20230121822A1

公开(公告)日：2023-04-20

申请号：US17914481

申请日：2020-04-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Hsiao-Jou Lin ,  Alexander Williams ,  Jon R. Dory

IPC: H04R1/10

Abstract: Structures and functions of wired headsets are disclosed. In an example, a wired headset includes a first earcup and a second earcup. A headband and a wire to connect with the first earcup. The first earcup connected to the wire is capable of rotation to facilitate routing of the headset wire from the first earcup to the second earcup along with the headband. The headset also includes latches and holders to hold the wire when it routes from the first earcup to the second earcup.