公开(公告)号：US09684589B2

公开(公告)日：2017-06-20

申请号：US14432245

申请日：2012-11-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kent E Biggs ,  Chi W So ,  Michael A Provencher

IPC: G06F12/02 ,  G06F13/16 ,  G06F9/455 ,  G06F9/44

CPC classification number: G06F12/0238 ,  G06F9/4401 ,  G06F9/45558 ,  G06F13/1636 ,  G06F2009/45583 ,  G06F2212/202 ,  G06F2212/251

Abstract: A computing device includes, a memory component, a memory module including memory resistors, and a virtualization module. The virtualization module intercepts communication between an application and a memory component and directs the communication to the memory module including memory resistors. The virtualization module directs communication from the memory module to the application.