公开(公告)号：US20230226613A1

公开(公告)日：2023-07-20

申请号：US17928905

申请日：2020-06-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Krzysztof NAUKA ,  Michelle Miao NIU ,  Vladek P. KASPERCHIK ,  Emre DISCEKICI

IPC: B22F10/60 ,  B22F10/14 ,  B29C64/165 ,  B29C64/255 ,  B22F12/42 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20

CPC classification number: B22F10/60 ,  B22F10/14 ,  B29C64/165 ,  B29C64/255 ,  B22F12/42 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes a build material distributor to deposit metal powder build material and an agent distribution system to selectively deposit a binding agent on the metal powder build material in a pattern of a layer of a three-dimensional (3D) object to be printed. The additive manufacturing system also includes an ultraviolet (UV) energy source. The UV energy source, in a layer-by-layer fashion 1) cures the binding agent to join together metal powder build material with binding agent disposed thereon and 2) evaporates a solvent of the binding agent.