公开(公告)号：US20220349082A1

公开(公告)日：2022-11-03

申请号：US17296931

申请日：2019-08-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Qingyong Guo ,  Ya Cheng Chuang ,  Yong-Jun Li ,  Kuan-Ting Wu

IPC: C25D13/22 ,  C25D9/06 ,  C25D13/12 ,  H05K5/04 ,  H05K5/06

Abstract: A coated metal alloy substrate, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises an electrolytic sealing layer on the metal alloy substrate, and an electrophoretic deposition layer deposited on the electrolytic sealing layer.

公开(公告)号：US20220341052A1

公开(公告)日：2022-10-27

申请号：US17637238

申请日：2019-10-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Qingyong Guo ,  Kuan-Ting Wu ,  Ya Cheng Chuang ,  Feng Gu

IPC: C25D13/12 ,  H05K5/04 ,  C25D13/20 ,  C23C18/16 ,  C23C18/18 ,  C23C28/00

Abstract: In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.